Results forklockner moeller flash memory modulefrom 40982 Products.
|
|
New type Outstanding thermal performance thermal gap pad for Memory Modules Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface ...
|
|
|
|
|
1.8W/mK 20 shore00 Moldability for complex parts heat sink pad ,3.0mmT for Memory Modules The TIF5120-18-11US is not only designed to take advantage of the gap heat transfer, to ...
|
|
|
|
|
7W/mK Silicone Thermal Pad TIF700Z UL94v-0 fire rating For RDRAM Memory Modules Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and ...
|
|
|
|
|
China company supplied thermal gap filler 4w/MK Specific Gravity 3.1 g/cc for RDRAM memory modules The TIF5200-40-11US is a silicone based, thermally conductive gap pad. Its ...
|
|
|
|
|
new developed ultra soft 2.9 G/CC CPU Thermal Pad TIF5200-30-11US 20 Shore 00 RoHS compliant For RDRAM memory modules Company Profile Ziitek Electronic Material and Technology Ltd. ...
|
|
|
|
|
China company supplied thermal gap filler 1.2w/MK densentity 2.0 g/cm3 for RDRAM memory modules The TIF120-12-05ES is a silicone based, thermally conductive gap pad. Its unreinforc...
|
|
|
|
|
1.5 W/mK,12±5 Shore 00,High durability thermal gap filler, drak gray for Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to ...
|
|
|
|
|
12±5 Shore00 China company supplied thermally conductive silicone rubber For Memory Modules The TIF1100-05ES thermal silicone pad is a product with both performance and economy. It ...
|
|
|
|
|
China company supplied Easy release construction thermal conductive gap pad for Memory Modules ,18 shore00,3.0W/mK Company Profile With a wide range, good quality, reasonable ...
|
|
|
|
|
insulation and ultra soft thermal conductive gap pad 1.0mmT, 12 Shore 00 for RDRAM memory modules The TIF140-30-11ES is a highly compliant Gap Pad material that is ideal for ...
|
|
|
|
|
1.5mmT Blue High Durability CPU Thermal Pad for RDRAM memory modules Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many ...
|
|
|
|
|
good performance thermal gap filler TIF1100-30-11ES,3.0 W/m-K for Memory Modules The TIF1100-30-11ES use a special process, with silicone as the base material, adding thermal ...
|
|
|
|
|
Dielectric constant 3.8 MHz Soft and Compressible Thermal Pad for Memory Modules Company Profile With professional R&D capabilities and over 13 year experiences in thermal ...
|
|
|
|
|
Electrically isolating UL recognized TIF120-50-11US thermal pad for Memory Modules ,5.0 W/mK The TIF120-50-11US is a silicone based, thermally conductive gap pad. Its unreinforced ...
|
|
|
|
|
5.0 MHz Moldability for Complex Parts Heat Sink Pad for Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment ...
|
|
|
|
|
1.0mmT Soft and compressible for Low Stress Applications Silicone Pads for Memory Modules The TIF140-30-02US use a special process, with silicone as the base material, adding ...
|
|
|
|
|
Dielectric Breakdown Voltage >5500 VAC Electrically Isolating Blue Thermal Pad for Memory Modules Company Profile Ziitek company is a high-tech enterprise which dedicated to the R...
|
|
|
|
|
1.5mmT popular and professional silicone pads for Memory Modules The TIF160-01US use a special process, with silicone as the base material, adding thermal conductive powder and ...
|
|
|
|
|
Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of ...
|
|
|
|
|
Moldability for complex parts Heat Sink Pad for Memory Modules, Continuos Use Temp -40 to 160℃ The TIF1140-10UF thermal silicone pad is a product with both performance and economy. ...
|
|
|
You may also be interested in :
