|
[China]
Trade Verify
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, China
Contact name:Dana
Dongguan Ziitek Electronical Material and Technology Ltd. |
|
Verified Suppliers
|
|
|
China company supplied Easy release construction thermal conductive gap pad for Memory Modules ,18 shore00,3.0W/mK
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
<Good thermal conductive
<Moldability for complex parts
<Soft and compressible for low stress applications
<notebook
<power supply
<Heat pipe thermal solutions
<Memory Modules
<Mass storage devices
<Automotive electronics
Typical Properties of TIF120-30-06US | |||
Product Name | TIF120-30-06US Series | ||
Colour | white | ||
Construction & Compostion | Ceramic filled silicone elastomer | ||
Specific gravity | 3.0 g/cc | ||
Thickness | 0.5mmT | ||
Hardness | 18 Shore 00 | ||
Dielectric constant@1MHz | 4.0 MHz | ||
Continuos Use Temp | -40to 160℃ | ||
Dielectric Breakdown Voltage | >5500 VAC | ||
Thermal conductivity | 3.0 W/mK | ||
| Volume Resistiviyt | 1.0*1012 Ohm-cm | ||
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
