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Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules 

Dongguan Ziitek Electronic Materials & Technology Ltd.

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Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

Contact name:Dana

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Thermal Gap Filler 4w/MK Specific Gravity 3.1 G/Cc For RDRAM Memory Modules 

Country/Region china
City & Province dongguan guangdong
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Product Details

China company supplied thermal gap filler 4w/MK Specific Gravity 3.1 g/cc for RDRAM memory modules
 

The TIF5200-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling


TIF500-40-11US Datasheet-REV02.pdf
 
Features:
>  Good thermal conductive: 4.0 W/mK 
>Thickness:5.0mmT
>hardnesses :20 (Shore 00)

>UL recognized

>Fiberglass reinforced for puncture, shear and tear resistance

>Easy release construction

>Electrically isolating

>High durability

 

Applications:

>RDRAM memory modules

>Micro heat pipe thermal solutions

>Automotive engine control units

>CD-Rom, DVD-Rom cooling

>LED Power Supply

>LED Controller

>LED Ceilinglamp

 
Typical Properties of TIF5200-40-11US Series
Color

gray

VisualComposite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

3.1 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Thickness

5.0mmT

***

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
20 (Shore 00)ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77 

Tensile Strength 

40 psi

ASTM D412

90mils / 2.286 mm

1.91 

100mils / 2.540 mm

2.05

Continuos Use Temp
-40 to 160℃

***

110mils / 2.794 mm

2.16   

120mils / 3.048 mm

2.29   

Dielectric Breakdown Voltage
>5500 VACASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
4.0 MHzASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
6.0X1013
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05 

200mils / 5.080 mm

3.14

 
Thermal conductivity 
4.0 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
 
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

 

TIF™ series Individual die cut shapes can be supplied.

 

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

 

FAQ:

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

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