Results formemory modules thermal gap padfrom 35 Products.
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2.0mmT Pink/White Outstanding Thermal Performance Thermal Pad for RDRAM Memory Modules The TIF280-20-02ES use a special process, with silicone as the base material, adding thermal ...
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China company supplied Good thermal conductive thermal gap pad UL recognized for Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to ...
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Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of ...
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New type Outstanding thermal performance thermal gap pad for Memory Modules Company Profile With professional R&D capabilities and over 13 year experiences in thermal interface ...
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Self adhesive Memory Modules thermal conductive gap pad,2.0mmT,1.5 W/mK,that China company supplied Company Profile With professional R&D capabilities and over 13 year experiences ...
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Electrically isolating UL recognized TIF120-50-11US thermal pad for Memory Modules ,5.0 W/mK The TIF120-50-11US is a silicone based, thermally conductive gap pad. Its unreinforced ...
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insulation and ultra soft thermal conductive gap pad 1.0mmT, 12 Shore 00 for RDRAM memory modules The TIF140-30-11ES is a highly compliant Gap Pad material that is ideal for ...
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China company supplied thermal gap filler 4w/MK Specific Gravity 3.1 g/cc for RDRAM memory modules The TIF5200-40-11US is a silicone based, thermally conductive gap pad. Its ...
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China company supplied thermal gap filler 1.2w/MK densentity 2.0 g/cm3 for RDRAM memory modules The TIF120-12-05ES is a silicone based, thermally conductive gap pad. Its unreinforc...
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5.0W/mk Good Thermal Conductive Heat Sink Pad for Memory Modules The TIF160N-50-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows ...
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Hardness 45±5 Shore 00 High Durability Thermal Pad for RDRAM Memory Modules The TIF740M is a silicone based, thermally conductive gap pad. Its unreinforced construction allows ...
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1.0mmT Soft and compressible for Low Stress Applications Silicone Pads for Memory Modules The TIF140-30-02US use a special process, with silicone as the base material, adding ...
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good performance thermal gap filler TIF1100-30-11ES,3.0 W/m-K for Memory Modules The TIF1100-30-11ES use a special process, with silicone as the base material, adding thermal ...
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Moldability for complex parts Heat Sink Pad for Memory Modules, Continuos Use Temp -40 to 160℃ The TIF1140-10UF thermal silicone pad is a product with both performance and economy. ...
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12±5 Shore00 China company supplied thermally conductive silicone rubber For Memory Modules The TIF1100-05ES thermal silicone pad is a product with both performance and economy. It ...
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Specific Gravity 3.3 g/cm^3 Moldability for Complex Parts Memory Modules Silicone Pads The TIF760M thermal silicone pad is a product with both performance and economy. It is a ...
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Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler for Memory Modules The TIF100-14E Series thermally conductive interface materials are applied to fill the ...
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Compressible 1.5w / Mk Thermal Gap Filler , Heat Conductive Materials For Memory Modules Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, ...
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5.0mmT Electrically Isolating Conductive Pads for RDRAM Memory Modules The TIF2200-20-02ES is not only designed to take advantage of the gap heat transfer, to fill gaps, complete ...
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TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production ...
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