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High Frequency Microwave/RF Rogers PCB printed circuit boards Maker
Quick detail:
Layer:4
Technology: Rogers+Rogers,Rogers+Fr4,Rogers+Taconic(Mix stack up) fabrication
Material:RO4350B,RO4003C,RT5880,RO3003,RO3006,RO3010,RT6010 substrate
Laminate thickness:0.127MM-1.524MM
Production time:5-15days(Stock material)
Copper weight:0.5OZ-5OZ
Surface finish: Immersion gold,HASL,Immersion tin/silver Etc
Origin: Shenzhen,China
Min line space: 8mil
Min line width: 8 mil
Board size: 16*12 cm
Rogers material features and Benefits(4000series):
PTFE
• Designed for performance ,sensitive, high volume applications
Low dielectric tolerance and low loss
• Excellent electrical performance
• Allows applications with higher operating frequencies
• Ideal for broadband applications
Stable electrical properties vs.frequency
• Controlled impedance transmission lines
• Repeatable design of filters
Low thermal coeffi cient of dielectric constant
• Excellent dimensional stability ,Low Z-axis expansion
• Reliable plated through holes
Low in-plane expansion coeffi cient
• Remains stable over an entire
range of circuit processing temperatures
Volume manufacturing process
• RO4000 laminates can be fabricated using standard glass epoxy processes
• Competitively priced CAF resistant
Some Typical Applications:
• Cellular Base Station Antennas and Power Amplifi ers
• RF Identifi cation Tags
• Automotive Radar and Sensors
• LNB’s for Direct Broadcast
Rogers material features and Benefits(6000series):
• High dielectric constant for circuit size reduction
• Low loss. Ideal for operating at X-band or below
• Low Z-axis expansion for RT/ duroid 6010LM. Provides reliable plated through holes in multilayer boards
• Low moisture absorption for RT/duroid 6010LM. Reduces effects of moisture on electrical loss
• Tight, and thickness control for repeatable circuit performance
Some Typical Applications:
• Patch Antennas
• Satellite Communications Systems
• Power Amplifi ers
• Aircraft Collision Avoidance Systems
• Ground Radar Warning Systems
Rogers substrate Features(Rogers5000):
• Lowest electrical loss for reinforced PTFE material
• Low moisture absorption
• Isotropic
• Uniform electrical properties over frequency
• Excellent chemical resistance
Some Typical Applications:
• Commercial Airline Broadband Antennas
• Microstrip and Stripline Circuits
• Millimeter Wave Applications
• Military Radar Systems
• Missile Guidance Systems
• Point to Point Digital Radio Antennas
Rogers substrate in stock(Oct1-31),any other rogers model,please email me for the delivery time
Brand | Model | Thickness(mm) |
Rogers | RO4003 | 0.254 0.508,0.813,1.524 |
RO4350 | 0.168,0.254 0.508,0.762,1.524 | |
RT5880 | 0.254.0.508.0.762 | |
RO3003 | 0.127,0.508,0.762,1.524 | |
RO3010 | 0.635 | |
RO3006 | 0.254 | |
RO3206 | 0.635MM | |
R03035 | 0.508MM | |
RT6010 | 0.635MM, 1,27MM |
High frequency PCB range:
Frequency Range: High-frequency PCBs are designed to operate in frequency ranges typically starting from a few megahertz (MHz) and extending into the gigahertz (GHz) and terahertz (THz) ranges. These PCBs are commonly used in applications such as wireless communication systems (e.g., cellular networks, Wi-Fi, Bluetooth), radar systems, satellite communication, and high-speed data transmission.
Signal Loss and Dispersion: At high frequencies, signal loss and dispersion become significant concerns. High-frequency PCBs employ techniques to minimize these effects, such as using low-loss dielectric materials, controlled impedance routing, and minimizing the length and number of vias.
PCB Stackup: The stackup configuration of a high-frequency PCB is carefully designed to address signal integrity requirements. It typically consists of multiple layers of copper traces, dielectric materials, and ground planes. The arrangement of these layers is optimized to control impedance, minimize crosstalk, and provide shielding.
RF Connectors: High-frequency PCBs often incorporate specialized RF connectors to ensure proper signal transmission and minimize losses. These connectors are designed to maintain consistent impedance and minimize reflections.
Electromagnetic Compatibility (EMC): High-frequency PCBs must comply with electromagnetic compatibility standards to prevent interference with other electronic devices and to avoid susceptibility to external interference. Proper grounding, shielding, and filtering techniques are employed to address EMC requirements.
Simulation and Analysis: Designing high-frequency PCBs often involves simulation and analysis using specialized software tools. These tools allow designers to assess signal integrity, impedance matching, and electromagnetic behavior before fabrication, helping to optimize the PCB design for high-frequency performance.
Fabrication Challenges: Fabricating high-frequency PCBs can be more challenging compared to standard PCBs. The use of specialized materials, controlled impedance requirements, and tight tolerances require advanced fabrication techniques such as accurate etching, controlled dielectric thickness, and precise drilling and plating processes.
Testing and Validation: High-frequency PCBs undergo rigorous testing and validation to ensure their performance meets the desired specifications. This includes impedance testing, signal integrity analysis, insertion loss measurement, and other RF and microwave tests.
It's important to note that the design and manufacturing of high-frequency PCBs are specialized areas requiring expertise in RF and microwave engineering, PCB layout, and fabrication processes. Working with experienced professionals and consulting relevant design guidelines and standards is crucial to ensure reliable performance at high frequencies.
High frequency PCB description:
High frequency PCB material in stock:
Brand | Model | Thickness(mm) | DK(ER) |
Rogers | RO4003C | 0.203mm,0.305mm,0.406mm,0.508mm,0.813mm,1.524mm | 3.38 ± 0.05 |
RO4350B | 0.101mm,0.168mm,0.254mm,0.338mm,0.422mm,0.508mm,0.762mm,1.524mm | 3.48 ± 0.05 | |
RO4360G2 | 0.203mm,0.305mm,0.406mm,0.508mm,0.610mm,0.813mm,1.524mm | 6.15 ± 0.15 | |
RO4835 | 0.168mm,0.254mm,0.338mm,0.422mm,0.508mm,0.591mm, 0.676mm,0.762mm,1.524mm | 3.48 ± 0.05 | |
RT5870 | 0.127mm,0.787mm,0.254mm,1.575mm,0.381mm,3.175mm,0.508mm | 2.33 2.33 ± 0.02 | |
RT5880 | 0.127mm,0.787mm,0.254mm,1.575mm,0.381mm,3.175mm,0.508mm | 2.20 2.20 ± 0.02 | |
RO3003 | 0.13mm,0.25mm,0.50mm,0.75mm,1.52mm | 3.00 ±0.04 | |
RO3010 | 0.13mm,0.25mm,0.64mm,1.28mm | 10.2 ± 0.30 | |
RO3006 | 0.13mm,0.25mm,0.64mm,1.28mm | 6.15 ± 0.15 | |
RO3203 | 0.25mm,0.50mm,0.75mm,1.52mm | 3.02±0.04 | |
RO3210 | 0.64mm,1.28mm | 10.2±0.50 | |
RO3206 | 0.64mm,1.28mm | 6.15±0.15 | |
R03035 | 0.13mm,0.25mm,0.50mm,0.75mm,1.52mm | 3.50 ± 0.05 | |
RT6002 | 0.127mm,0.254mm,0.508mm,0.762mm,1.524mm,3.048mm | 2.94 ± 0.04 | |
RT6006 | 0.127mm,0.254mm,0.635mm,1.27mm,1.90mm,2.50mm | 6.15± 0.15 | |
RT6010 | 0.127mm,0.254mm,0.635mm,1.27mm,1.90mm,2.50mm | 10.2 ± 0.25 | |
TACONIC | TLX-8.TLX-9 | 0.508. 0.762 | 2.45-2.65 |
TLC-32 | 0.254,0.508,0.762 | 3.35 | |
TLY-5 | 0.254,0.508.0.8, | 2.2 | |
RF-60A | 0.254.0.508.0.762 | 6.15 | |
CER-10 | 0.254.0.508.0.762 | 10 | |
RF-30 | 0.254.0.508.0.762 | 3 | |
TLA-35 | 0.8 | 3.2 | |
ARLON | AD255C06099C | 1.5 | 2.55 |
MCG0300CG | 0.8 | 3.7 | |
AD0300C | 0.8 | 3 | |
AD255C03099C | 0.8 | 2.55 | |
AD255C04099C | 1 | 2.55 | |
DLC220 | 1 | 2.2 |