Chinese Substrate High Frequency PCB F4b Printed Circuit Board Fabrication

Chinese substrate F4b 2Layer HIGH FREQUENCY PCB printed circuit boards Fabrication

PCB information:

Material: F4Bm255  Chinese high frequency material

Surface finish: OSP

Copper weight:2OZ

Color: Black

Size: 5*5 CM Circle

Thickness: 1.6MM

Basic characteristics of high-frequency substrate materials require:

(1) The dielectric constant (Dk) must be small and stable. Usually, the smaller the better, the slower the transmission rate of the signal is inversely proportional to the square root of the dielectric constant of the material. High dielectric constant can easily cause signal transmission delay.

(2) Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission. The smaller the dielectric loss, the smaller the signal loss.

(3) The coefficient of thermal expansion of copper foil should be as consistent as possible, because the inconsistency will cause separation of copper foil in cold and hot changes.

(4) Low water absorbency and high water absorption will affect dielectric constant and dielectric loss when exposed to moisture.

(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.

In general, high frequencies can be defined as frequencies above 1 GHz. Currently used high-frequency circuit board substrates are fluorine-based dielectric substrates, such as polytetrafluoroethylene (PTFE), which is usually referred to as Teflon. Above 5GHz. There are also FR-4 or PPO substrates that can be used between 1GHz and 10GHz. The physical properties of these three high-frequency substrates are compared as follows.

At the present stage, the three types of high-frequency substrate materials used are epoxy resin, PPO resin, and fluorine-based resin. The epoxy resin is the cheapest and the fluorine-based resin is the most expensive; the dielectric constant, dielectric loss, and water absorption Considering the frequency characteristics, the fluorine resin is the best and the epoxy resin is poor. When the frequency of application of the product is higher than 10 GHz, only the fluororesin printed board can be applied. Obviously, the high-frequency performance of fluorine-based resin is much higher than that of other substrates. However, its disadvantages are poor rigidity and high coefficient of thermal expansion, in addition to high cost. For polytetrafluoroethylene (PTFE), a large amount of inorganic material (eg, silica SiO2) or glass cloth is used as a reinforcing filler material to improve the rigidity of the substrate and reduce the thermal expansion thereof for the purpose of improving the performance. In addition, due to the molecular inertness of the PTFE resin itself, it is not easy to combine with the copper foil. Therefore, a special surface treatment with the copper foil is required. Treatment methods include chemical etching or plasma etching on the surface of Teflon to increase the surface roughness or to increase the adhesion between the copper foil and Teflon resin to increase the bonding force, but may have a dielectric property. influences.

The development of the entire fluorine-based high-frequency circuit board requires cooperation among raw material suppliers, research institutes, equipment suppliers, PCB manufacturers, and communication product manufacturers to keep up with the rapid development of high-frequency circuit boards. 

High frequency PCB range:

Frequency Range: High-frequency PCBs are designed to operate in frequency ranges typically starting from a few megahertz (MHz) and extending into the gigahertz (GHz) and terahertz (THz) ranges. These PCBs are commonly used in applications such as wireless communication systems (e.g., cellular networks, Wi-Fi, Bluetooth), radar systems, satellite communication, and high-speed data transmission.

Signal Loss and Dispersion: At high frequencies, signal loss and dispersion become significant concerns. High-frequency PCBs employ techniques to minimize these effects, such as using low-loss dielectric materials, controlled impedance routing, and minimizing the length and number of vias.

PCB Stackup: The stackup configuration of a high-frequency PCB is carefully designed to address signal integrity requirements. It typically consists of multiple layers of copper traces, dielectric materials, and ground planes. The arrangement of these layers is optimized to control impedance, minimize crosstalk, and provide shielding.

RF Connectors: High-frequency PCBs often incorporate specialized RF connectors to ensure proper signal transmission and minimize losses. These connectors are designed to maintain consistent impedance and minimize reflections.

Electromagnetic Compatibility (EMC): High-frequency PCBs must comply with electromagnetic compatibility standards to prevent interference with other electronic devices and to avoid susceptibility to external interference. Proper grounding, shielding, and filtering techniques are employed to address EMC requirements.

Simulation and Analysis: Designing high-frequency PCBs often involves simulation and analysis using specialized software tools. These tools allow designers to assess signal integrity, impedance matching, and electromagnetic behavior before fabrication, helping to optimize the PCB design for high-frequency performance.

Fabrication Challenges: Fabricating high-frequency PCBs can be more challenging compared to standard PCBs. The use of specialized materials, controlled impedance requirements, and tight tolerances require advanced fabrication techniques such as accurate etching, controlled dielectric thickness, and precise drilling and plating processes.

Testing and Validation: High-frequency PCBs undergo rigorous testing and validation to ensure their performance meets the desired specifications. This includes impedance testing, signal integrity analysis, insertion loss measurement, and other RF and microwave tests.

It's important to note that the design and manufacturing of high-frequency PCBs are specialized areas requiring expertise in RF and microwave engineering, PCB layout, and fabrication processes. Working with experienced professionals and consulting relevant design guidelines and standards is crucial to ensure reliable performance at high frequencies.

High frequency PCB description:

 

High-frequency PCB (Printed Circuit Board) refers to a type of PCB that is designed to handle high-frequency signals, typically in the radio frequency (RF) and microwave ranges. These PCBs are engineered to minimize signal loss, maintain signal integrity, and control impedance at high frequencies.

 

Here are some key considerations and features of high-frequency PCBs:

 

Material Selection: High-frequency PCBs often use specialized materials with low dielectric constant (Dk) and low dissipation factor (Df). Common materials include PTFE (Polytetrafluoroethylene), FR-4 with enhanced properties, and specialized laminates like Rogers or Taconic.

 

Controlled Impedance: Maintaining consistent impedance is crucial for high-frequency signals. High-frequency PCBs employ controlled impedance routing, which involves precise trace widths, spacing, and dielectric thickness to achieve the desired characteristic impedance.

 

Signal Integrity: High-frequency signals are susceptible to noise, reflections, and losses. PCB design techniques such as proper ground plane placement, signal return paths, and controlled crosstalk are employed to minimize signal degradation and maintain signal integrity.

 

Transmission Lines: High-frequency PCBs often incorporate transmission lines, such as microstrip or stripline, to carry the high-frequency signals. These transmission lines have specific geometries to control impedance and minimize signal loss.

 

Via Design: Vias can impact signal integrity at high frequencies. High-frequency PCBs may use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.

 

Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.

 

Shielding: To minimize electromagnetic interference (EMI) and RF leakage, high-frequency PCBs may employ shielding techniques such as copper pours, ground planes, or metal shielding cans.

 

High-frequency PCBs find applications in various industries, including wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.

 

Designing and manufacturing high-frequency PCBs require specialized skills, knowledge, and simulation tools to ensure the desired performance at high frequencies. It is often recommended to work with experienced PCB designers and manufacturers who specialize in high-frequency applications.

 

High frequency PCB material in stock:

 

Brand	Model	Thickness(mm)	DK(ER)
Rogers	RO4003C	0.203mm,0.305mm,0.406mm,0.508mm,0.813mm,1.524mm	3.38 ± 0.05
	RO4350B	0.101mm,0.168mm,0.254mm,0.338mm,0.422mm,0.508mm,0.762mm,1.524mm	3.48 ± 0.05
	RO4360G2	0.203mm,0.305mm,0.406mm,0.508mm,0.610mm,0.813mm,1.524mm	6.15 ± 0.15
	RO4835	0.168mm,0.254mm,0.338mm,0.422mm,0.508mm,0.591mm, 0.676mm,0.762mm,1.524mm	3.48 ± 0.05
	RT5870	0.127mm,0.787mm,0.254mm,1.575mm,0.381mm,3.175mm,0.508mm	2.33 2.33 ± 0.02
	RT5880	0.127mm,0.787mm,0.254mm,1.575mm,0.381mm,3.175mm,0.508mm	2.20 2.20 ± 0.02
	RO3003	0.13mm,0.25mm,0.50mm,0.75mm,1.52mm	3.00 ±0.04
	RO3010	0.13mm,0.25mm,0.64mm,1.28mm	10.2 ± 0.30
	RO3006	0.13mm,0.25mm,0.64mm,1.28mm	6.15 ± 0.15
	RO3203	0.25mm,0.50mm,0.75mm,1.52mm	3.02±0.04
	RO3210	0.64mm,1.28mm	10.2±0.50
	RO3206	0.64mm,1.28mm	6.15±0.15
	R03035	0.13mm,0.25mm,0.50mm,0.75mm,1.52mm	3.50 ± 0.05
	RT6002	0.127mm,0.254mm,0.508mm,0.762mm,1.524mm,3.048mm	2.94 ± 0.04
	RT6006	0.127mm,0.254mm,0.635mm,1.27mm,1.90mm,2.50mm	6.15± 0.15
	RT6010	0.127mm,0.254mm,0.635mm,1.27mm,1.90mm,2.50mm	10.2 ± 0.25
TACONIC	TLX-8.TLX-9	0.508. 0.762	2.45-2.65
	TLC-32	0.254,0.508,0.762	3.35
	TLY-5	0.254,0.508.0.8,	2.2
	RF-60A	0.254.0.508.0.762	6.15
	CER-10	0.254.0.508.0.762	10
	RF-30	0.254.0.508.0.762	3
	TLA-35	0.8	3.2
ARLON	AD255C06099C	1.5	2.55
	MCG0300CG	0.8	3.7
	AD0300C	0.8	3
	AD255C03099C	0.8	2.55
	AD255C04099C	1	2.55
	DLC220	1	2.2