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Introducing our newly shipped PCB based on TC350 substrates - a cutting-edge solution for high-power applications. The TC350 laminates are designed with advanced materials, including PTFE, highly thermally conductive ceramic fillers, and woven glass reinforcement. This unique combination offers exceptional performance in terms of low insertion loss, higher thermal conductivity, and superior reliability, allowing for reduced operating temperatures in demanding environments.
With excellent dielectric constant stability across various temperatures, the TC350 laminates are ideal for power amplifier and antenna designers seeking to maximize gain and minimize bandwidth loss. They also provide crucial stability for phase and impedance sensitive devices like network transformers and Wilkinson Power Dividers.
| Property | Units | Value | Test Merthod |
| 1. Electrical Properties | |||
| Dielectric Constant (may vary by thickness) | |||
| @1 MHz | － | 3.50 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 3.50 | RESONANT CAVITY |
| @10 GHz | － | 3.50 | IPC TM-650 2.5.5.5 |
| Dissipation Factor | |||
| @1 MHz | － | 0.0015 | IPC TM-650 2.5.5.3 |
| @1.8 GHz | － | 0.0018 | RESONANT CAVITY |
| @10 GHz | － | 0.0020 | IPC TM-650 2.5.5.5 |
| Temperature Coefficient of Dielectric | － | ||
| TC r @ 10 GHz (-40-150°C) | ppm/ºC | -9 | IPC TM-650 2.5.5.5 |
| Volume Resistivity | |||
| C96/35/90 | MΩ-cm | 7.4x106 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ-cm | 1.4x108 | |
| Surface Resistivity | |||
| C96/35/90 | MΩ | 3.2x107 | IPC TM-650 2.5.17.1 |
| E24/125 | MΩ | 4.3x108 | IPC TM-650 2.5.17.1 |
| Electrical Strength | Volts/mil (kV/mm) | 780 (31) | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | kV | 40 | IPC TM-650 2.5.6 |
| Arc Resistance | sec | >240 | IPC TM-650 2.5.1 |
| 2.Thermal Properties | |||
| Decomposition Temperature (Td) | |||
| Initial | °C | 520 | IPC TM-650 2.4.24.6 |
| 5% | °C | 567 | IPC TM-650 2.4.24.6 |
| T260 | min | >60 | IPC TM-650 2.4.24.1 |
| T288 | min | >60 | IPC TM-650 2.4.24.1 |
| T300 | min | >60 | IPC TM-650 2.4.24.1 |
| Thermal Expansion, CTE (x,y) 50-150ºC | ppm/ºC | 7, 7 | IPC TM-650 2.4.41 |
| Thermal Expansion, CTE (z) 50-150ºC | ppm/ºC | 12 | IPC TM-650 2.4.24 |
| % z-axis Expansion (50-260ºC) | % | 1.2 | IPC TM-650 2.4.24 |
| 3. Mechanical Properties | |||
| Peel Strength to Copper (1 oz/35 micron) | |||
| After Thermal Stress | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| At Elevated Temperatures (150ºC) | lb/in (N/mm) | 9 (1.6) | IPC TM-650 2.4.8.2 |
| After Process Solutions | lb/in (N/mm) | 7 (1.2) | IPC TM-650 2.4.8 |
| Young’s Modulus | kpsi (MPa) | IPC TM-650 2.4.18.3 | |
| Flexural Strength (Machine/Cross) | kpsi (MPa) | 14/10 (97/69) | IPC TM-650 2.4.4 |
| Tensile Strength (Machine/Cross) | kpsi (MPa) | 11/8 (76/55) | IPC TM-650 2.4.18.3 |
| Compressive Modulus | kpsi (MPa) | ASTM D-3410 | |
| Poisson’s Ratio | － | ASTM D-3039 | |
| 4. Physical Properties | |||
| Water Absorption | % | 0.05 | IPC TM-650 2.6.2.1 |
| Density, ambient 23ºC | g/cm3 | 2.30 | ASTM D792 Method A |
| Thermal Conductivity | W/mK | 0.72 | ASTM D5470 |
| Specific Heat | J/gK | 0.90 | ASTM D5470 |
| Flammability | class | V0 | UL-94 |
| NASA Outgassing, 125ºC, ≤10- 6 torr | |||
| Total Mass Loss | % | 0.02 | NASA SP-R-0022A |
| Collected Volatiles | % | 0.01 | NASA SP-R-0022A |
| Water Vapor Recovered | % | 0.01 | NASA SP-R-0022A |
This PCB features several notable features and benefits. The TC350 laminates offer a dielectric constant (Dk) of 3.5 at 1MHz, 1.8GHz, and 10GHz, ensuring consistent performance. With a dissipation factor as low as 0.0015 at 1MHz, 0.0018 at 1.8GHz, and 0.002 at 10GHz, signal integrity is maintained even at high frequencies. The laminates exhibit excellent thermal properties, including a low thermal coefficient of Dk, high thermal conductivity of 0.72 W/mk, and a wide temperature range of T260, T288, T300 > 60 minutes. These features contribute to reduced junction temperature, improved reliability, efficient heat dissipation, and enhanced bandwidth utilization for amplifiers and antennas.
This PCB is a 2-layer rigid design with a copper layer thickness of 35 μm on each side. The TC350 core has a thickness of 0.508 mm (20mil). With a finished board thickness of 0.6mm and a finished copper weight of 1oz (1.4 mils) on the outer layers, this PCB offers robust construction while maintaining compactness. The 20 μm via plating thickness, surface finish of Hot Air Soldering Level (HASL), and 0.5mm vias filled by resin and capped ensure reliable electrical connections and structural integrity. The green solder mask on both the top and bottom layers provides protection and a professional finish.
| PCB Material: | Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
| Designation: | TC350 |
| Dielectric constant: | 3.5±0.05 |
| Thermal Conductivity | 0.72 W/m-K |
| Dissipation Factor | Df .002@10 GHz |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
In terms of statistics, this PCB supports the installation of 19 components and offers a total of 48 pads, including 26 through-hole pads and 22 top surface mount technology (SMT) pads. With 25 vias and 3 nets, the PCB facilitates efficient interconnection and flexibility in circuit design. It undergoes a rigorous 100% electrical test before shipment to ensure optimal performance.
This TC350-based PCB adheres to the IPC-Class-2 quality standard and is compatible with Gerber RS-274-X artwork. It is readily available worldwide, making it accessible for various projects and applications. Some typical applications include power amplifiers, filters, couplers, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), thermally cycled antennas sensitive to dielectric drift, and microwave combiners and power dividers.
Experience the advantages of our TC350-based PCB, offering exceptional performance, reliability, and thermal management for your high-power electronic designs.
