|
[China]
Trade Verify
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact name:Ivy Deng
Bicheng Electronics Technology Co., Ltd |
|
Verified Suppliers
|
|
|
Introducing our latest shipment of PCBs based on TMM3: the ultimate solution for high-reliability strip-line and micro-strip applications. The Rogers TMM3 thermoset microwave material combines the best features of ceramic and traditional PTFE microwave circuit laminates, all without the need for specialized production techniques. With TMM3 laminates, you can enjoy the benefits of exceptional performance and reliability while avoiding pad lifting or substrate deformation during wire-bonding.
The TMM3 substrates offer exceptional performance and reliability. With a dielectric constant (Dk) of 3.27 +/- .032 at 10GHz and a dissipation factor as low as .0020 at 10GHz, these PCBs ensure consistent signal performance and excellent signal integrity. They also feature a thermal coefficient of Dk of 37 ppm/°K for stability across temperature variations and a high decomposition temperature (Td) of 425°C TGA for thermal stability. Additionally, the PCBs have a copper-matched coefficient of thermal expansion and a thermal conductivity of 0.7W/mk for enhanced reliability and efficient heat dissipation. Available in a thickness range of .0015 to .500 inches (+/- .0015”), these PCBs provide versatility to meet various design requirements.
| Property | TMM3 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 3.27±0.032 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
| Dielectric Constant,εDesign | 3.45 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of dielectric constant | +37 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
| Volume Resistivity | 2 x 109 | - | Mohm.cm | - | ASTM D257 | |
| Surface Resistivity | >9x 10^9 | - | Mohm | - | ASTM D257 | |
| Electrical Strength(dielectric strength) | 441 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
| Thermal Properties | ||||||
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
| Coefficient of Thermal Expansion - x | 15 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Y | 15 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Coefficient of Thermal Expansion - Z | 23 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
| Thermal Conductivity | 0.7 | Z | W/m/K | 80 ℃ | ASTM C518 | |
| Mechanical Properties | ||||||
| Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
| Flexural Strength (MD/CMD) | 16.53 | X,Y | kpsi | A | ASTM D790 | |
| Flexural Modulus (MD/CMD) | 1.72 | X,Y | Mpsi | A | ASTM D790 | |
| Physical Properties | ||||||
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.06 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.12 | |||||
| Specific Gravity | 1.78 | - | - | A | ASTM D792 | |
| Specific Heat Capacity | 0.87 | - | J/g/K | A | Calculated | |
| Lead-Free Process Compatible | YES | - | - | - | - | |
Benefits:
1. Mechanical properties resist creep and cold flow, ensuring
long-term stability.
2. Resistant to process chemicals, reducing damage during
fabrication.
3. No sodium napthanate treatment required prior to electroless
plating.
4. Reliable wire-bonding due to the thermoset resin base.
This PCB has specifications supplied to meet diverse needs. It's a 2-layer rigid PCBs with a copper layer thickness of 35 μm on each side. The Rogers TMM3 Core has a thickness of 0.508 mm (20mil), providing structural integrity. These PCBs come in a compact size of 51mm x 25mm (1PCS), with a tolerance of +/- 0.15mm. They offer a minimum Trace/Space of 4/7 mils, allowing for precise circuit design, and a minimum Hole Size of 0.4mm to accommodate various component placements. With a finished board thickness of 0.6mm, a finished Cu weight of 1oz (1.4 mils) on outer layers, and a via plating thickness of 20 μm, these PCBs are optimized for reliable interconnection and optimal conductivity. They feature an immersion gold surface finish, green solder mask on both top and bottom layers, and undergo a 100% electrical test prior to shipment to ensure their quality.
| PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
| Designation: | TMM3 |
| Dielectric constant: | 3.27 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc.. |
PCB Statistics:
Supports 15 components.
Total of 26 pads: 17 through-hole pads, 9 top SMT pads.
12 vias and 2 nets for efficient interconnection.
Quality and Availability:
IPC-Class-2 quality standard.
Compatible with Gerber RS-274-X artwork.
Available worldwide for easy access.
Typical Applications:
RF and microwave circuitry.
Power amplifiers and combiners.
Filters and couplers.
Satellite communication systems.
Global Positioning Systems (GPS) Antennas.
Patch Antennas.
Dielectric polarizers and lenses.
Chip testers.
Experience exceptional performance, reliability, and versatility with our TMM3-based PCBs. Contact us today to elevate your RF, microwave, and power applications.
