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Introducing our newly shipped PCB based on RO4003C Low Profile. It's a high-performance laminate designed to deliver exceptional signal integrity and low insertion loss while offering cost-effective circuit fabrication. Utilizing Rogers' proprietary technology, the RO4003C LoPro laminates combine reverse treated foil bonding with the standard RO4003C dielectric, resulting in a laminate with low conductor loss and improved insertion loss. This unique technology maintains all the desirable attributes of the standard RO4003C laminate system. The hydrocarbon ceramic laminates of RO4003C are specifically engineered for superior high-frequency performance and compatibility with standard epoxy/glass (FR-4) processes, eliminating the need for specialized via preparation methods like sodium etch, thereby reducing manufacturing costs.
With a dielectric constant of 3.38+/- 0.05 at 10 GHz/23°C and a dissipation factor of 0.0027 at 10 GHz/23°C, the RO4003C Low Profile PCB ensures accurate and reliable signal transmission. It exhibits excellent thermal properties with a Td> 425°C and a high Tg exceeding 280 °C TMA. The laminate boasts a high thermal conductivity of 0.64 W/mK, efficiently dissipating heat. Its Z-axis coefficient of thermal expansion is low at 46 ppm/°C, while the copper-matched coefficient of thermal expansion ranges from -55 to 288 °C with 11 ppm/°C for the X axis and 14 ppm/°C for the Y axis. Additionally, the PCB is lead-free process compatible, aligning with environmental concerns.
The RO4003C Low Profile PCB brings numerous benefits to your designs. Its lower insertion loss allows for higher operating frequency designs, even surpassing 40 GHz. It reduces passive inter-modulation (PIM) for base station antennas, ensuring optimal performance. The lower conductor loss contributes to improved thermal performance. With its multilayer PCB capability and design flexibility, it accommodates complex circuitry requirements. The PCB can withstand high-temperature processing and is resistant to CAF (Conductive Anodic Filament) formation, ensuring long-term reliability.
| Property | Typical Value | Direction | Units | Condition | Test Method |
| Dielectric Constant, Process | 3.38 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, Design | 3.5 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factor tan, | 0.0027 0.0021 | z | -- | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coeffifi cient of r | 40 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 X 1010 | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 X 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | z | KV/mm(V/mil) | 0.51mm(0.020”) | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 26889(3900) | Y | MPa(kpsi) | RT | ASTM D638 |
| Tensile Strength | 141(20.4) | Y | MPa(kpsi) | RT | ASTM D638 |
| Flexural Strength | 276(40) | MPa(kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m(mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
| Coeffifi cient of Thermal Expansion | 11 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| 14 | y | ||||
| 46 | z | ||||
| Tg | >280 | °C TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | °C TGA | ASTM D3850 | ||
| Thermal Conductivity | 0.64 | W/m/°K | 80°C | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 | |
| Density | 1.79 | gm/cm3 | 23°C | ASTM D792 | |
| Copper Peel Strength | 1.05(6.0) | N/mm(pli) | after solder float 1 oz. TC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-Free Process Compatible | Yes |
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4003C LoPro |
| Dielectric constant: | 3.38±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
This PCB is a 2-layer rigid board with a stackup consisting of a 35 μm copper layer, a 60.7mil (1.542mm) Rogers RO4003C LoPro substrate, and another 35 μm copper layer. It adheres to IPC-Class-2 standards, ensuring high quality and reliability. The board dimensions are 86.6mm x 90.8mm, and each order includes 16 PCBs. The minimum trace/space is 4/4 mils, and the minimum hole size is 0.4mm. The finished board thickness is 1.6mm, with a 1 oz (1.4 mils) outer layer copper weight. The via plating thickness is 20 μm, and the surface finish is immersion gold. The top solder mask is green, while the bottom solder mask is not present. The PCB undergoes a thorough 100% electrical test before shipment, ensuring its performance and reliability.
The RO4003C Low Profile PCB is suitable for a wide range of applications. It excels in digital applications such as servers, routers, and high-speed backplanes. It is also ideal for cellular base station antennas and power amplifiers, as well as LNB's (Low-Noise Block Downconverters) for direct broadcast satellites. Additionally, it finds applications in RF Identification Tags and other high-frequency designs.
Choose the RO4003C Low Profile PCB for superior signal integrity, low insertion loss, and cost-effective circuit fabrication. Experience reliable and high-performance circuitry with this advanced PCB material.
