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1500mpa·S Edgebanding Hot Melt Adhesive Chip Board Woodworking EVA-JF-202

WUXI WANLI ADHESION MATERIALS CO., LTD.

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Address: Changjiang South Road, No.17-17, Wuxi, Jiangsu 214000, CN

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1500mpa·S Edgebanding Hot Melt Adhesive Chip Board Woodworking EVA-JF-202

Country/Region china
City & Province wuxi jiangsu
Categories Adhesives & Sealants
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Product Details

Factory Directly Supply EVA Hot Melt Adhesive WANLI® EVA-JF-202 with Viscosity 11500±1500mpa·s (180℃) for Chip Board Edge Bonding

 

Wanli® EVA hot melt adhesive JF-202 for 3D lamination & edgebanding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for 3D lamination bonding of chip board to various kinds of decorative paper and edgebanding bonding of chip board to various kind of edge band. It is featured fast curing, high bonding strength and lower cost.

 

APPLICATION

Wanli® EVA hot melt adhesive JF-202 is used for 3D lamination bonding of chip board to various kinds of decorative paper and edgebanding bonding of chip board to various kind of edge band.

 

Application MaterialWoodworking 3D Lamination & Edgebanding Hot Melt Adhesives
AppearanceRound yellow particles
ComponentEVA
Application IndustryWoodworking Edgebanding
Solid Content100%
Operating Temperature170~190 ℃( Depend On Machine, Substrate, Environment And Other Conditions).
Softening Temperature88~98 ℃
Melt Viscosity11500±1500mpa·s (180℃)
CuringNormal Temperature Curing
Usage Scope3D lamination and edgebanding
Shelf Life2 Years
Package25Kg/Bag

 

FEATURE

Fast curing, high bonding strength and lower cost

 

USER GUIDE

The package of JF-202 is suitable for various dispensing equipment. Especially for high-speed automatic 3D lamination machines. Recommended tank temperature is 170~190℃. Recommended sizing temperature is 170~190℃. Recommended dosage is 40g~80g/㎡.

 

STORAGE

Storage humidity less than 70% RH, temperature should be 5~25℃, please pay attention to avoid direct sunlight, FIFO.

 

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