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3D Lamination EVA Hot Melt Adhesive Edgebanding Chip Board Woodworking EVA-JF-202

WUXI WANLI ADHESION MATERIALS CO., LTD.

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Address: Changjiang South Road, No.17-17, Wuxi, Jiangsu 214000, CN

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3D Lamination EVA Hot Melt Adhesive Edgebanding Chip Board Woodworking EVA-JF-202

Country/Region china
City & Province wuxi jiangsu
Categories Adhesives & Sealants
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Product Details

Good Quality Factory Directly EVA Hot Melt Adhesive WANLI® EVA-JF-202 with Soften Temperature 93±5 ℃ for Edge Bonding of Various Kinds of Substrates to Various Kinds of Surface Materials

 
Wanli® EVA hot melt adhesive JF-202 for 3D lamination & edgebanding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for edgebanding bonding of chip board to various kind of edge band and 3D lamination bonding of chip board to various kinds of decorative paper. It is featured lower cost, high bonding strength and fast curing.
 
APPLICATION
Wanli® EVA hot melt adhesive JF-202 is used for edgebanding bonding of chip board to various kind of edge band and 3D lamination bonding of chip board to various kinds of decorative paper.

 

Application MaterialWoodworking 3D Lamination & Edgebanding Hot Melt Adhesives
AppearanceRound yellow particles
ComponentEVA
Application IndustryWoodworking Edgebanding
Solid Content100%
Operating Temperature170~190 ℃( Depend On Machine, Substrate, Environment And Other Conditions).
Softening Temperature93±5 ℃
Melt Viscosity11500±1500mpa·s (180℃)
CuringNormal Temperature Curing
Usage Scope3D lamination and edgebanding
Shelf Life2 Years
Package25Kg/Bag

 
FEATURE
Lower cost, high bonding strength and fast curing
 
USER GUIDE
The package of JF-202 is suitable for various dispensing equipment. Especially for high-speed automatic 3D lamination machines. Recommended dosage is 40~80g/㎡. Recommended sizing temperature is 180±10℃. Recommended tank temperature is 180±10℃. 
 
STORAGE
Storage temperature should be 5~25℃, humidity less than 70% RH, please pay attention to avoid direct sunlight, FIFO.

 

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