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Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

WUXI WANLI ADHESION MATERIALS CO., LTD.

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Address: Changjiang South Road, No.17-17, Wuxi, Jiangsu 214000, CN

Contact name:Rona

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Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

Country/Region china
City & Province wuxi jiangsu
Categories Adhesives & Sealants
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Product Details

Hot Sale Factory Direct 100% Solid White Round Particles EVA Hot Melt Adhesive WANLI® EVA-JF-108 for Edge Bonding with High Bonding Strength

 

Wanli® EVA hot melt adhesive JF-108 for edge bonding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for bonding of chip board to various kinds of edge band. It is featured high bonding strength, lower cost and fast curing.

 

APPLICATION

Wanli® EVA hot melt adhesive JF-108 is used for bonding of chip board to various kinds of edge band.

 

Application MaterialWoodworking Edgebanding Hot Melt Adhesives
AppearanceWhite Solid Particles
ComponentEVA
Application IndustryWoodworking Edgebanding
Solid Content100%
Operating Temperature180~200℃( Depend On Machine, Substrate, Environment And Other Conditions).
Softening Temperature95~105℃
Melt Viscosity70000±10000mpa·s (200℃)
CuringNormal Temperature Curing
Usage ScopeEdge Bonding of Wood Materials- Chip Board
Shelf Life2 * Years
Package25Kg/Bag

 

FEATURE

High bonding strength, lower cost and fast curing

 

USER GUIDE

The package of JF-108 is suitable for various dispensing equipment. The recommended operating temperature is 180℃~200℃, which depends on the equipment, substrate and environment and other conditions.

 

STORAGE

Store indoors and do not expose to extreme weather conditions (e.g. rain or exposure to sunlight). The storage temperature should be no more than 35℃ and avoid open fire or heat source.

 

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