8-Layer Rigid Hybrid PCB Built On RO3003 And FR4 With Blind Via

Introducing our advanced 8-layer rigid PCB, which incorporates a combination of Rogers RO3003 ceramic-filled PTFE composites and S1000-2M High Tg170 FR-4 substrates, delivering exceptional performance and reliability. This PCB is engineered to meet the demanding requirements of a wide range of applications, ensuring precise signal transmission and minimizing signal loss with its dielectric constant of 3.0 +/- .04 at 10 GHz and a dissipation factor of 0.001 at the same frequency.

Outstanding mechanical properties and thermal stability are provided by the Rogers RO3003 and S1000-2M substrates, exhibiting a low coefficient of thermal expansion (CTE) of 17 ppm/°C, 16 ppm/°C, and 25 ppm/°C in the X, Y, and Z axes, respectively. Reliable stripline and multi-layer board constructions are achieved, making it an ideal choice for applications that demand exceptional performance across a wide temperature range from -40℃ to +85℃.

The stackup of this PCB comprises eight layers, incorporating copper layers, Rogers 3003 core, and S1000-2M FR-4 substrates. This construction ensures optimal signal performance, dimensional stability, and flexibility for intricate designs. With a board dimension of 122.3mm x 94.4mm, ample space is provided for component placement, supporting a minimum trace/space of 4/4 mils and a minimum hole size of 0.35mm.

IPC-Class-2 standards are adhered to during manufacturing, guaranteeing high-quality production and compliance with industry guidelines. Rigorous 100% electrical testing is conducted on each PCB prior to shipment, ensuring flawless performance and reliability.

Construction details include a finished board thickness of 2.2mm, inner layers with a copper weight of 0.5 oz (0.7 mils), and outer layers with a copper weight of 1 oz (1.4 mils). Via plating thickness is 20μm, while the surface finish is Immersion Gold, providing excellent conductivity and corrosion resistance. The top and bottom silkscreens are white, while the top and bottom solder masks are Matt Black. Silkscreen is intentionally omitted on solder pads to prevent interference.

With 81 components and 143 pads, our PCB is suitable for various applications such as bandpass filters, microstrip patch antennas, voltage-controlled oscillators, and applications sensitive to temperature change. Its exceptional performance and reliability make it an ideal choice for demanding projects.

Worldwide availability is ensured for our PCB, allowing customers from across the globe to benefit from its superior performance. For any technical inquiries or further information, please do not hesitate to contact our sales team at sales10@bichengpcb.com.

Choose our advanced 8-layer rigid PCB with Rogers RO3003 and S1000-2M substrates for your next project and experience the exceptional reliability and performance that your applications demand.