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Introducing our newly shipped RF PCB which is based on rogers RT duroid 5870 material. Rogers RT/duroid 5870 high-frequency laminates are composite materials made of PTFE reinforced with glass microfibers. These laminates offer exceptional high-frequency performance with a low dielectric constant (Dk). The random orientation of microfibers in the PTFE composite ensures consistent Dk values. RT/duroid 5870 laminates are ideal for applications requiring high frequency and broadband performance, where minimizing dispersion and losses is crucial.
Features:
Dielectric Constant: Boasting a low dielectric constant (Dk) of 2.33 with a tight tolerance of 0.02 at 10 GHz/23°C, the RT/duroid 5870 PCB ensures optimal signal integrity and minimized dispersion.
Dissipation Factor: With an impressively low dissipation factor of 0.0012 at 10 GHz, this PCB guarantees minimal signal loss, making it an ideal choice for high-frequency and broadband applications.
Temperature Stability: The temperature coefficient of dielectric constant (TCDk) of -115 ppm/°C ensures consistent performance even in varying temperature environments.
Moisture Absorption: Benefit from superior moisture resistance, as the RT/duroid 5870 PCB exhibits a moisture absorption rate of just 0.02%, providing reliability in high moisture environments.
Dimensional Stability: Enjoy excellent dimensional stability with a CTE (Coefficient of Thermal Expansion) of 22 ppm/°C (X-axis), 28 ppm/°C (Y-axis), and 173 ppm/°C (Z-axis), ensuring reliable performance under changing thermal conditions.
Isotropic Design: The RT/duroid 5870 PCB features an isotropic design, delivering uniform electrical properties across different directions.
| RT/duroid 5870 Typical Value | ||||||
| Property | RT/duroid 5870 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.33 2.33±0.02 spec. | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Dielectric Constant,εDesign | 2.33 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0005 0.0012 | Z | N/A | C24/23/50 C24/23/50 | 1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 | |
| Thermal Coefficient of ε | -115 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) | N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1300(189) | 490(71) | X | ||||
| 1280(185) | 430(63) | Y | ||||
| Ultimate Stress | 50(7.3) | 34(4.8) | X | |||
| 42(6.1) | 34(4.8) | Y | ||||
| Ultimate Strain | 9.8 | 8.7 | X | % | ||
| 9.8 | 8.6 | Y | ||||
| Compressive Modulus | 1210(176) | 680(99) | X | MPa(kpsi) | A | ASTM D 695 |
| 1360(198) | 860(125) | Y | ||||
| 803(120) | 520(76) | Z | ||||
| Ultimate Stress | 30(4.4) | 23(3.4) | X | |||
| 37(5.3) | 25(3.7) | Y | ||||
| 54(7.8) | 37(5.3) | Z | ||||
| Ultimate Strain | 4 | 4.3 | X | % | ||
| 3.3 | 3.3 | Y | ||||
| 8.7 | 8.5 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.22 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 22 28 173 | X Y Z | ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 27.2(4.8) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
Benefits:
Optimal Electrical Performance: Experience the lowest electrical loss among reinforced PTFE materials, guaranteeing efficient and reliable signal transmission in your electronic designs.
Ease of Processing: The RT/duroid 5870 PCB is easy to cut, shape,
and machine, allowing for flexible customization to meet your
specific project requirements.
Chemical Resistance: Enjoy resistance to solvents and reagents used in etching or plating processes, ensuring long-lasting durability and reliability.
Wide Range of Applications: This versatile PCB is suitable for various applications, including commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave systems, radar systems, guidance systems, and point-to-point digital radio antennas.
Proven Reliability: The RT/duroid 5870 PCB is built using a well-established material trusted by industry professionals, ensuring consistent and proven performance.
Wide Frequency Range: Achieve uniform electrical properties over a broad frequency range, enabling reliable operation across diverse electronic systems.
PCB Specifications:
PCB Stackup: 2-layer rigid PCB
Copper Layer Thickness: 35 μm (both layers)
RT/duroid 5870 Thickness: 0.127 mm (5mil)
Board Dimensions: 60.8mm x 60.8 mm (± 0.15mm)
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.2mm
Finished Board Thickness: 0.2mm
Finished Copper Weight: 1oz (1.4 mils) outer layers
Via Plating Thickness: 20 μm
Surface Finish: Immersion gold
Silkscreen: Top (White), Bottom (None)
Solder Mask: Top (None), Bottom (None)
Electrical Testing: Rigorously tested to ensure 100% functionality
prior to shipment
Additional Information:
PCB Statistics: 8 components, 19 pads (10 thru-hole pads, 9 top SMT
pads, 0 bottom SMT pads), 7 vias, 2 nets
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Available worldwide
Elevate the performance of your electronic designs with the
outstanding high-frequency capabilities of the RT/duroid 5870 PCB.
Unleash enhanced efficiency, reliability, and versatility in your
projects.
For further information, please contact our team at sales10@bichengpcb.com. We offer worldwide availability and are ready to assist you with your RF PCB needs.
