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Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact name:Ivy Deng
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Today, we are happy to share our newly shipped PCB based on RO3010 materials.
1. RO3010 Introduction:
Rogers RO3010 laminates are advanced circuit materials that utilize
ceramic-filled PTFE composites. These laminates offer a higher
dielectric constant with excellent stability. They are
competitively priced products known for their exceptional
mechanical and electrical stability, making them suitable for a
wide range of applications across various frequencies. RO3010
laminates simplify the design of broadband components and are
particularly well-suited for circuit miniaturization.
2. Features:
RO3010 laminates are composed of ceramic-filled PTFE composites.
They exhibit a dielectric constant of 10.2 +/- 0.30 at 10 GHz and
23°C, along with a low dissipation factor of 0.0022 at the same
frequency and temperature. With a low coefficient of thermal
expansion ranging from 13 ppm/°C to 16 ppm/°C (-55 to 288 °C) in
the X, Y, and Z axes, RO3010 laminates demonstrate excellent
dimensional stability. They have a high thermal decomposition
temperature exceeding 500°C and a thermal conductivity of 0.95
W/mK. RO3010 laminates also boast a low moisture absorption rate of
0.05% and can operate in the temperature range of -40℃ to +85℃.
| RO3010 Typical Value | |||||
| Property | RO3010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 11.2 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0022 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | -395 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.35 0.31 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
| Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
| Tensile Modulus | 1902 1934 | X Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.05 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
| Specific Heat | 0.8 | j/g/k | Calculated | ||
| Thermal Conductivity | 0.95 | W/M/K | 50℃ | ASTM D 5470 | |
| Coefficient of Thermal Expansion (-55 to 288℃) | 13 11 16 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | ℃ TGA | ASTM D 3850 | ||
| Density | 2.8 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 9.4 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
3. Benefits:
One of the notable benefits of RO3010 laminates is their
dimensional stability, with the expansion coefficient matched to
that of copper. This characteristic enhances the reliability and
performance of the laminates. Additionally, RO3010 laminates are
cost-effective, thanks to their economical laminate pricing
resulting from a volume manufacturing process. They are also
suitable for use in multi-layer board designs, providing
flexibility in various applications.
4. PCB Stackup:
For this 2-layer rigid PCB, the stackup consists of a copper layer
with a thickness of 35 μm, followed by the RO3010 substrate with a
thickness of 10mil (0.254mm), and another copper layer with a
thickness of 35 μm.
5. PCB Construction Details:
This PCB has a board dimensions of 80.1mm x 56.74 mm for a single
piece. The minimum trace/space is 4/4 mils, and the minimum hole
size is 0.3mm. There are no blind vias in this configuration. The
finished board thickness is 0.37mm, and the outer copper layers
have a weight of 1 oz (1.4 mils). The via plating thickness is 20
μm. The surface finish is immersion gold, and the top silkscreen is
white, while no silkscreen or solder mask is applied to the bottom
layer. A 100% electrical test is conducted to ensure the quality of
the PCB before shipment.
6. PCB Statistics:
This PCB includes 24 components and a total of 71 pads. Among these
pads, 51 are through-hole pads, and 23 are top surface-mount
technology (SMT) pads. There are no bottom SMT pads. The design
features 67 vias and consists of 3 nets.
7. Supplied Artwork Type: Gerber RS-274-X
8. Accepted Standard: IPC-Class-2
9. Availability: RO3010 laminates are available worldwide, ensuring accessibility for various markets.
10. Typical Applications:
RO3010 PCBs find application in a wide range of industries and
products. They are particularly suitable for automotive radar
applications, global positioning satellite antennas, cellular
telecommunications systems (including power amplifiers and
antennas), patch antennas for wireless communications, direct
broadcast satellites, cable systems for data link, remote meter
readers, and power backplanes. The exceptional electrical and
mechanical properties of RO3010 laminates make them reliable and
versatile for these applications.
