Bicheng Electronics Technology Co., Ltd |
Verified Suppliers
|
|
Introducing our newly shipped PCB made of RO306 substrates.
RO3006 Introduction:
Rogers RO3006 laminates are advanced circuit materials that utilize
ceramic-filled PTFE composites. These materials are specifically
designed to offer exceptional stability in both electrical and
mechanical properties. One notable feature of RO3006 is its ability
to maintain a stable dielectric constant (Dk) over a wide
temperature range. This characteristic eliminates the step change
in Dk that is commonly observed in PTFE glass materials near room
temperature.
Features:
RO3006 laminates from Rogers consist of ceramic-filled PTFE
composites. These materials exhibit a dielectric constant of 6.15
+/- 0.15 at 10 GHz and 23°C, along with a low dissipation factor of
0.002 at the same frequency and temperature. With a high thermal
decomposition temperature exceeding 500°C, RO3006 demonstrates
excellent thermal stability. It also offers a thermal conductivity
of 0.79 W/mK, facilitating efficient heat transfer. In terms of
moisture absorption, RO3006 boasts a low rate of 0.02%.
Additionally, the material's coefficient of thermal expansion
ranges from 17 ppm/°C to 24 ppm/°C (-55 to 288 °C) in the X, Y, and
Z axes.
Benefits:
RO3006 laminates provide uniform mechanical properties across a
range of dielectric constants, making them ideal for multi-layer
board designs that require different dielectric constants. These
laminates are also compatible with hybrid designs that involve
epoxy glass multi-layer boards. Another advantage of RO3006 is its
low in-plane expansion coefficient, which matches that of copper.
This characteristic enhances the reliability of surface-mounted
assemblies and makes it suitable for applications sensitive to
temperature changes. Furthermore, RO3006 exhibits excellent
dimensional stability. The volume manufacturing process used for
these laminates ensures economical pricing, making them a
cost-effective choice.
RO3006 Typical Value | |||||
Property | RO3006 | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 6.15±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 6.5 | Z | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor,tanδ | 0.002 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | -262 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Dimensional Stability | 0.27 0.15 | X Y | mm/m | COND A | IPC-TM-650 2.2.4 |
Volume Resistivity | 105 | MΩ.cm | COND A | IPC 2.5.17.1 | |
Surface Resistivity | 105 | MΩ | COND A | IPC 2.5.17.1 | |
Tensile Modulus | 1498 1293 | X Y | MPa | 23℃ | ASTM D 638 |
Moisture Absorption | 0.02 | % | D48/50 | IPC-TM-650 2.6.2.1 | |
Specific Heat | 0.86 | j/g/k | Calculated | ||
Thermal Conductivity | 0.79 | W/M/K | 50℃ | ASTM D 5470 | |
Coefficient of Thermal Expansion (-55 to 288℃) | 17 17 24 | X Y Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
Td | 500 | ℃ TGA | ASTM D 3850 | ||
Density | 2.6 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 7.1 | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
PCB Stackup and Construction Details:
For this 2-layer rigid PCB, the stackup consists of a copper layer
with a thickness of 35 μm, followed by the RO3006 substrate with a
thickness of 25mil (0.635mm), and another copper layer with a
thickness of 35 μm.
The PCB construction details include a board size of 30mm x 37mm for a single piece. The minimum trace/space is 5/5 mils, and the minimum hole size is 0.25mm. There are no blind vias in this configuration. The finished board thickness is 0.8mm, and the outer copper layers have a weight of 1 oz (1.4 mils). The via plating thickness is 20 μm. The surface finish is immersion gold, and the top silkscreen is white, while no silkscreen is applied to the bottom. Additionally, no solder mask is present on the top or bottom layers. Prior to shipment, a 100% electrical test is conducted to ensure quality.
PCB Statistics:
In terms of PCB statistics, this configuration includes 15
components and a total of 50 pads. Out of these pads, 31 are
through-hole pads, while 19 are top surface-mount technology (SMT)
pads. There are no bottom SMT pads. This PCB design incorporates 38
vias and consists of 2 nets.
Artwork and Standards:
The supplied artwork type for this PCB design is Gerber RS-274-X, a
widely accepted industry standard. The accepted standard for this
design is IPC-Class-2, ensuring compliance with quality and
performance requirements.
Availability and Typical Applications:
RO3006 laminates are available worldwide, providing accessibility
for various markets. These laminates find application in several
industries. They are particularly suitable for automotive radar
applications, global positioning satellite antennas, cellular
telecommunications systems (including power amplifiers and
antennas), patch antennas for wireless communications, direct
broadcast satellites, cable systems for data link, remote meter
readers, and power backplanes. Their exceptional electrical and
mechanical properties make them versatile and reliable for a wide
range of applications.