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HDI 5G Optical Module PCB High Frequency Circuit Board RO4350B TU768

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Address: Building C5/B6, Yanchuan North Industrial Park, Yanluo Street, Baoan District, Shenzhen, China

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HDI with 1+N+1 High frequency

Project	PCB process capability
Layer count	1-40 Layers
Min outer line width/space	3/3mil
Outer copper thickness	280um(8OZ)
Inner copper thickness	210um(6OZ)
Tolerance of PCB thickness	board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers board thickness＞1.0mm; ±10%
Minimum PTH	Mechanical hole 4mil, laser 3mil
Material	FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide
HDI	Levels 2-7
Special Process	Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance;

FR-4 High Layer PCB with Immersion Silver Surface Finish and Green Solder Mask *, *::before, *:...

High Layer PCB Board with 0.1mm Min. Solder Mask Clearance for High Layer Design *, *::before, *:...

HDI with 3+N+3 window.onload=function(){ var tfrow = document.getElementById('tfhover').rows.length; ...

HDI with 1+N+1 High frequency window.onload=function(){ var tfrow = document.getElementById('tfhover...

10km Transmission Distance FR-4 5G Module PCB for Stable Signal Transmission *, *::before, *::after ...

High-Performance 5G Optical Module PCB RoHS Compliant 25mm X 25mm 4 Layers *, *::before, *::after ...

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