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3 Laser 4 Lamination HDI PCB 3 N 3 With Mechanical Hole 4mil

Shenzhen Benqiang Circuits Co,Ltd.

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Address: Building C5/B6, Yanchuan North Industrial Park, Yanluo Street, Baoan District, Shenzhen, China

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3 Laser 4 Lamination HDI PCB 3 N 3 With Mechanical Hole 4mil

Country/Region china
City & Province shenzhen
Categories Electronic Signs
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Product Details

HDI with 3+N+3

ProjectPCB process capability
Layer count1-40 Layers
Min outer line width/space3/3mil
Outer copper thickness280um(8OZ)
Inner copper thickness210um(6OZ)
Tolerance of PCB thicknessboard thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers
board thickness>1.0mm; ±10%
Minimum PTHMechanical hole 4mil, laser 3mil
MaterialFR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide
HDILevels 2-7
Special Process

Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance;

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