Ro3003g2 Rogers PCB Gold Plated High Level Quality PCB Circuit Boards

Rogers 3003 Gold Plated High Level Quality PCB Circuit Boards

Quick detail:

Material:High frequency rogers 3003

Layer:2

Surface finish:Gold plated

Board size:6*3cm

Thickness:0.8mm

Copper weight:0.5OZ

Name:rogers 3003 gold plated high level qulity PCB printed circuit boards

Rogers - High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminat ( not PTFE ) designed for performance sensitive, high volume commercial applications

Rogers 3003 PCB:

The RO3003 from Rogers Corp. is a ceramic-filled PTFE composite/laminate for use in commercial microwave and RF applications. It features excellent stability with a dielectric constant of 3 up to 40 GHz at room temperature. The material has a dissipation factor (Df) of 0.0013 at 10 GHz and is ideal for band pass filters, microstrip patch antennas, and voltage controlled oscillators.

By far the most commonly used is the Rogers RO4000 series of high frequency materials.

RO4350B laminate is a hydrocarbon/ceramic base, which can be manufactured using

standard FR-4 type multilayer processes, making it not only popular but economical to

manufacture. Low dielectric loss is the major appealing characteristic of this material.

Multilayers can be constructed of a “pure package” using Rogers 4450 prepreg, or by using standard FR-4 prepreg. Popular constructions limit the Rogers material to the “caps” of the stackup thereby managing overall cost by using the material only where it is required, and filling the remainder of the board with standard FR-4 cores/prepreg.

PTFE, commonly known as “Teflon” is another fairly common callout for this genre’s

material requirements. There are many different formulations and laminates such as

Rogers 3000 series ceramic-filled PTFE composites, R/T Duroid 5870 and 5880 glass

microfiber reinforced PTFE, etc. They can be very difficult in multilayer configurations

however, as some require the use of high temperature bonding films or adhesives. The old saying that “nothing likes to stick to Teflon!” sometimes holds true! But their extremely low loss characteristics make them ideal for exacting stripline and microstrip circuit designs.

PCB basic information:

RT/duriod

Rogers RT/duroid® high-frequency circuit materials are filled PTFE (irregular glass or ceramic) composite coversfor use in high reliability, aviation and defense applications. The RT/duroid types have a long industry nearness of providing high-reliability materials with predominant performance. This kind of material has several benefits:

1 Low electrical loss,
2. Low moisture absorption,
3. Stable dielectric constant (Dk) over a wide frequency range, and
4. Low outgassing for space applications.

RO3000

RO3000 laminates are ceramic filled PTFE composites intended for use in the commercial microwave and RF applications. R03000 series laminates are circuit materials with very consistent mechanical properties regardless of the dielectric constant selected. Due to this characteristic, when designing multi-layer boards with varying dielectric constants, there will be very little issues if any at all The dielectric constant VS temperature of RO3000 series materials is very stable. RO3000 laminates also are available in a wide range of dielectric constants (3.0 to 10.2). The most common applications are:

1. Surface mount RF components,
2.GPS antennas, and
3. Power amplifiers.

RO4000

RO4000 laminates and pre-pregs possess favorable properties that are highly useful in microwave circuits and instances where controlled impedance is needed. This series of laminates are very price optimized and are also fabricated using standard FR4 processes which makes it suitable for multi-layer PCBs. Additionally, it can be processed lead-free. The series of RO4000 laminates offer a range of dielectric constants (2.55-6.15) and are available with UL 94 V-0 flame retardant versions. The most popular applications of this are:

1. RFID chips,
2. Power amplifiers,
3. Automotive radars, and
4. Sensors.

TMM®
Rogers TMM® thermoset microwave laminates fuse dielectric constant uniformity, low thermal coefficient of dielectric constant (Dk), and a copper matched coefficient of thermal expansion. Because of their electrical and mechanical stability, TMM high-frequency laminates are perfect for high-reliability strip-line and micro-strip applications. This kind of material has several benefits:

1. Wide range of dielectric constants (Dks),
2.Excellent mechanical properties, cold flow, and resists creep,
3. Exceptionally low thermal coefficient of Dk,
4. Coefficient of thermal expansion fit to copper taking into account high reliability of plated through-holes,
5. Available copper clad in larger formats, allowing the use of standard PCB subtractive processes,
6. No wreck to materials during fabrication and assembly processes,  Resistant to process chemicals,
7. Thermoset resin for reliable wire bonding,
8. No specialized production techniques required,
9. TMM 10 and 10i laminates can replace alumina substrates, and
10. RoHS compliant, environmentally friendly.Below is a table that shows the characteristics of various types of PCB materials.