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Rogers 3006 6.15 Dielectric Constant PCB Manufacturer And Supplier

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Rogers 3006 6.15 Dielectric Constant PCB Manufacturer And Supplier

Country/Region china
City & Province foshan
Categories Digital Cameras
InquireNow

Product Details

Rogers 3006 Boards 6.15 Dielectric Constant PCB manufacturer and Supplier

 

 

Quick detail:

 

Layer:2

Material:Rogers3006 0.254mm,datasheet check here

Board size: 13.5*16.9CM

Surface finish: Immersion gold

Copper Weight: 1OZ

Solder mask: yellow

Silk Screen: White

Delivery time: Sample for 3 days, Mass production

 

Rogers 3003 / 3006 raw material information:

 

RO3000 pcb circuit boards

RO3000  high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.

RO3003 excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant, which occurs near room temperature with PTFE glass materials. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GhZ.

Rogers 3003 material Standard Thickness

RO3003/RO3035: 0.005” (0.13mm) 0.010” (0.25mm) 0.020” (0.50mm) 0.030” (0.75mm) 0.060” (1.52mm)

RO3006/RO3010: 0.005” (0.13mm) 0.010” (0.25mm) 0.025” (0.64mm) 0.050” (1.28mm)

Rogers 3003/3006/3010/3035 PCB laminate standard panel size:

12” X 18” (305 X 457mm) 24” X 18” (610 X 457mm)

 

Basic information:

 

Place of Origin:

China

Brand Name:

ONE

Port

Shenzhen,HongKong

Minimum Order Quantity:

1pcs

Price:

Please send gerber file for accurate price

Packaging Details:

Inner:vacuum packed bubble bag Outer:carton box

Delivery Time:

3-8days

Payment Terms:

T/T,western union,paypal,L/C

Supply Ability:

1, 000, 000PCS/week

 

RT/duriod

 

Rogers RT/duroid® high-frequency circuit materials are filled PTFE (irregular glass or ceramic) composite coversfor use in high reliability, aviation and defense applications. The RT/duroid types have a long industry nearness of providing high-reliability materials with predominant performance. This kind of material has several benefits:

1 Low electrical loss,
2. Low moisture absorption,
3. Stable dielectric constant (Dk) over a wide frequency range, and
4. Low outgassing for space applications.

RO3000

RO3000 laminates are ceramic filled PTFE composites intended for use in the commercial microwave and RF applications. R03000 series laminates are circuit materials with very consistent mechanical properties regardless of the dielectric constant selected. Due to this characteristic, when designing multi-layer boards with varying dielectric constants, there will be very little issues if any at all The dielectric constant VS temperature of RO3000 series materials is very stable. RO3000 laminates also are available in a wide range of dielectric constants (3.0 to 10.2). The most common applications are:

1. Surface mount RF components,
2.GPS antennas, and
3. Power amplifiers.

RO4000

RO4000 laminates and pre-pregs possess favorable properties that are highly useful in microwave circuits and instances where controlled impedance is needed. This series of laminates are very price optimized and are also fabricated using standard FR4 processes which makes it suitable for multi-layer PCBs. Additionally, it can be processed lead-free. The series of RO4000 laminates offer a range of dielectric constants (2.55-6.15) and are available with UL 94 V-0 flame retardant versions. The most popular applications of this are:

1. RFID chips,
2. Power amplifiers,
3. Automotive radars, and
4. Sensors.

TMM®
Rogers TMM® thermoset microwave laminates fuse dielectric constant uniformity, low thermal coefficient of dielectric constant (Dk), and a copper matched coefficient of thermal expansion. Because of their electrical and mechanical stability, TMM high-frequency laminates are perfect for high-reliability strip-line and micro-strip applications. This kind of material has several benefits:

1. Wide range of dielectric constants (Dks),
2.Excellent mechanical properties, cold flow, and resists creep,
3. Exceptionally low thermal coefficient of Dk,
4. Coefficient of thermal expansion fit to copper taking into account high reliability of plated through-holes,
5. Available copper clad in larger formats, allowing the use of standard PCB subtractive processes,
6. No wreck to materials during fabrication and assembly processes,  Resistant to process chemicals,
7. Thermoset resin for reliable wire bonding,
8. No specialized production techniques required,
9. TMM 10 and 10i laminates can replace alumina substrates, and
10. RoHS compliant, environmentally friendly.Below is a table that shows the characteristics of various types of PCB materials.

 

 

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