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Featured Products: A Plane Sapphire Substrate Wafer Thk 440um OF Length (mm) 16 LED Chip, Crystal Orientation C/M0.2 Sapphire Wafer Thk 440μm, EPI Ready Sapphire Substrate Wafer Edge R Type Mirror Polished and more.
JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430μm, crystal orientation C/M0.2, OF length (mm) 16 LED chip,substrate material The substrate is prepared from sapphire...
2inch Patterned Sapphire Substrates,LED Chip,Substrate Material Patterned Sapphire Substrates (PSS) are fabricated and used in GaN-based LEDs in order to increase the internal ...
A-plane±0.2o Patterned Sapphire Substrates BOW ≤-8~0μm Edge Round The formation of LEDs on patterned sapphire substrates is the most cost-effective method for manufacturing such ...
Back Laser Making Patterned Sapphire Substrates BOW ≤-8~0μm TTV≤5μm 2inch Patterned Sapphire Substrates,LED Chip,Substrate Material And, the enhancement in the internal quantum ...
50.80±0.10mm Patterned Sapphire Substrates 430±10μm A-Plane±0.2o 2inch Patterned Sapphire Substrates,LED Chip,Substrate Material With the breakthrough of the patterned-sapphire ...
A-Plane±0.2o Patterned Sapphire Substrates BOW≤-8~0μM Back Surface Roughness 0.8~1.2μm 2inch Patterned Sapphire Substrates,LED Chip,Substrate Material The regular patterns created ...
DAD3350 Wafer Dicing Machine Automatic Dicing Saw 1.8 kW, 2.2 kW Process controls Auto alignment, auto focus, auto kerf check, and other image recognition functions have been ...
DAD3350 Wafer Dicing Machine X-Axis Cutting Range 260mm 1.8 KW, 2.2 KW Process quality By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, ...