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Address: Building 11, Lane 1333, Jiangnan Avenue, Changxing Town, Chongming District, Shanghai

Contact name:Xiwen Bai (Ciel)

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Shanghai GaNova Electronic Information Co., Ltd.

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Featured Products: A Plane Sapphire Substrate Wafer Thk 440um OF Length (mm) 16 LED Chip, Crystal Orientation C/M0.2 Sapphire Wafer Thk 440μm, EPI Ready Sapphire Substrate Wafer Edge R Type Mirror Polished and more.
50mm Sapphire Substrate Wafer Thk 430μm OF Length (Mm) 16 LED Chip JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430μm, crystal orientation C/M0.2, OF length (mm) 16 ...
[Last Updated : 2024-04-26]
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Crystal Orientation C/M0.2 50mm Sapphire Substrate Wafer Thk 430μm JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430μm, crystal orientation C/M0.2, OF length (mm) 16 ...
[Last Updated : 2024-04-26]
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Thk 430μm 50mm Sapphire Substrate Wafer Wafer Edge R-Type Mirror Polished,EPI-Ready JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430μm, crystal orientation C/M0.2, ...
[Last Updated : 2024-04-26]
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Diameter 50mm Sapphire Substrate Wafer Mirror Polished EPI-Ready JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430μm, crystal orientation C/M0.2, OF length (mm) 16 ...
[Last Updated : 2024-04-26]
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JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430μm, crystal orientation C/M0.2, OF length (mm) 16 LED chip,substrate material The substrate is prepared from sapphire...
[Last Updated : 2024-04-26]
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A-Plane(11-20) Surface Orientation Sapphire Wafer Front Surface Quality Mirror Polished,EPI-Ready JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430μm, crystal ...
[Last Updated : 2024-04-26]
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Thk 430μm Sapphire Substrate Wafer Crystal Orientation C/M0.2, OF Length (Mm) 16 LED Chip JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430μm, crystal orientation C...
[Last Updated : 2024-04-26]
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High Purity Al2O3>99.995% R9 Mirror Polished EPI-Ready Wafer edge R-type JDCD08-001-001 Diameter 50mm Sapphire substrate wafer , Thk 430μm, crystal orientation C/M0.2, OF length ...
[Last Updated : 2024-04-26]
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2inch Patterned Sapphire Substrates,LED Chip,Substrate Material Patterned Sapphire Substrates (PSS) are fabricated and used in GaN-based LEDs in order to increase the internal ...
[Last Updated : 2024-04-26]
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A-plane±0.2o Patterned Sapphire Substrates BOW ≤-8~0μm Edge Round The formation of LEDs on patterned sapphire substrates is the most cost-effective method for manufacturing such ...
[Last Updated : 2024-04-26]
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Dimension 50.80±0.10mm Patterned Sapphire Substrates Thickness 430±10μm 2inch Patterned Sapphire Substrates,LED Chip,Substrate Material Patterned Sapphire Substrates (PSS) is micro...
[Last Updated : 2024-04-26]
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Back Surface Roughness 0.8~1.2μm Patterned Sapphire Substrates Flat Edge Width 16±1.0mm 2inch Patterned Sapphire Substrates,LED Chip,Substrate Material Patterned Sapphire ...
[Last Updated : 2024-04-26]
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Back Surface Roughness 0.8~1.2μm Patterned Sapphire Substrates Round Edge 2inch Patterned Sapphire Substrates,LED Chip,Substrate Material Patterned Sapphire Substrates (PSS) is a ...
[Last Updated : 2024-04-26]
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50.80±0.10mm Patterned Sapphire Substrates Flat Edge Angle A-Plane±0.2o 2inch Patterned Sapphire Substrates,LED Chip,Substrate Material The efficacy enhancement of GaN-based LEDs ...
[Last Updated : 2024-04-26]
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Back Laser Making Patterned Sapphire Substrates BOW ≤-8~0μm TTV≤5μm 2inch Patterned Sapphire Substrates,LED Chip,Substrate Material And, the enhancement in the internal quantum ...
[Last Updated : 2024-04-26]
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50.80±0.10mm Patterned Sapphire Substrates 430±10μm A-Plane±0.2o 2inch Patterned Sapphire Substrates,LED Chip,Substrate Material With the breakthrough of the patterned-sapphire ...
[Last Updated : 2024-04-26]
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A-Plane±0.2o Patterned Sapphire Substrates BOW≤-8~0μM Back Surface Roughness 0.8~1.2μm 2inch Patterned Sapphire Substrates,LED Chip,Substrate Material The regular patterns created ...
[Last Updated : 2024-04-26]
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Flat Edge Angle 16±1.0mm Patterned Sapphire Substrates Front Surface Roughness ≤0.25nm 2inch Patterned Sapphire Substrates,LED Chip,Substrate Material Patterned Sapphire Substrates ...
[Last Updated : 2024-04-26]
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DAD3350 Wafer Dicing Machine Automatic Dicing Saw 1.8 kW, 2.2 kW Process controls Auto alignment, auto focus, auto kerf check, and other image recognition functions have been ...
[Last Updated : 2024-04-26]
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DAD3350 Wafer Dicing Machine X-Axis Cutting Range 260mm 1.8 KW, 2.2 KW Process quality By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, ...
[Last Updated : 2024-04-26]
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