High Density Multilayer Circuit Board For Phone Medical Devices

High Density Multilayer Printed PCB For Phone

HDI design requires the latest advances in the PCB interconnection technology: With the latest state of the art PCB technology, HDI PCBs can be defined as those printed circuit boards that make use of some or all of the following features; Blind and buried via or micro via techniques, high signal performance considerations, micro vias, and built-up PCB laminations. High-density Interconnection or HDI is a PCB technology that came to the limelight close to the end of the 20th century. Its popularity grew tremendously due to the numerous advantages it holds over the traditional PCBs.

Advantages Of HDI PCB

1.HDI PCBs can be populated on both sides of the board to allow designers to incorporate more components onto smaller boards.
2.It also allows for higher and more efficient density transmission and computing in smaller end-user products, such as military equipment, smartphones, medical devices, and aerospace equipment.
3.HDI PCBs assure more reliability in transmission when you get to the point of mass production in your PCB design, if the BGA and GFP packages you are using is smaller, HDI PCBs have more space to contain more dense BGA and QFP packages as compared to traditional PCB technology.

Board Stack Report

China PCB manufacturer Shenzhen YUE TONG Electronic is a quick turn printed circuit board manufacturer specializing in prototype to medium production volumes. We are structured to offer aggressive cost savings with a flexible production line to meet critical schedules. Production orders can be filled in 1 to 3 weeks. Our company has got the approval UL certificate, ISO9001 certificate and ISO14001 certificate.

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