HDI PCB fabrication is rapidly becoming the ultimate solution for
smaller, more efficient, and more durable PCBs. High-Density
Interconnect (HDI) is a high-performance design that is
characterized by its high density of components and routing
Interconnections that use micro vias, blind and buried via or micro
via techniques, and built-up Print Circuit Boards (PCBs)
laminations. HDI PCB design is preferable for reducing the overall
cost;this isdone by decreasing the size and the number of layers as
compared to a standard technology PCB design. It also offers better
electrical performance and is one of the key technologies driving
advancements in PCB electronics.
The Six Main Types Of HDI PCB Boards
1. Burial through and through channels
2. Use core-free structure with layer pairs.
3. Passive substrate, no electrical connection
4. By surface to surface offset
5. Two / more HDI layers and vias
6. A core-free alternative structure using a pair of layers
Our Service
1.Quick Quotation: Competitive factory direct price is always
offered.
2.Free Sample: Before mass production, we offer Sample for free.
3.Quality Control: Complete test procedure is arranged before
delivery.
4.On Time Delivery: According to customer's requirement and the
lead time can be negotiated.
About Yue Tong Electronic
Offering from low quantity to mass production, with high quality
available at a low cost. So if you are looking to get the best and
affordable HDI PCB manufacturing service, welcome to contact us for
more information.
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