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6 nozzles PWB 23500CPH SMT Chip Mounter Juki Ke-3010

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Address: A1517, Guanhualiantou Commercial Building, West Coast Garden Complex, Jincheng Road, Haoyi Community, Shajing Street, Baoan District, Shenzhen

Contact name:JOY Liang

Shenzhen Meraif Import And Export Co., Ltd.

6 nozzles PWB 23500CPH SMT Chip Mounter Juki Ke-3010

Country/Region	china
City & Province	shenzhen guangdong
Categories	Electronics Production Machinery

Product Details

Juki smt pick and place machine Ke-3010/Chip mounter Ke-3010/smd pick and place machine

Chip mounter Ke-3010 Features:

Continued Evolution of the KE Series

Chip

1. 23,500CPH chip (Laser centering/Optimum)

2.18,500CPH (Laser centering / IPC9850)

3.IC 9,000CPH (Vision centering/MNVC option)

4.From 0402(01005) to 33.5mm square components

5.One multi-nozzle laser head (6 nozzles)

6.The use of electronic double tape feeders enables mounting of a maximum of 160 component types.

7.High-speed, on-the-fly vision centering

(When using both high-resolution camera and MNVC. (option))

8.Longer sized PWB in X axis(option)

Chip mounter Ke-3010 Specifications:

Board size	M size (330×250 mm)
	L size (410×360 mm)
	L-Wide size (510×360 mm) *1
	XL size (610×560 mm)
	Applicability to long PWB (L size)*2		800×360mm
	Applicability to long PWB (L-Wide size)*2		1,010×360mm
	Applicability to long PWB (XL size)*2		1,210×560mm
Component height	6mm
	12mm
Component size	Laser recognition		0402(01005)~33.5mm
	Vision recognition	Standard camera	3mm*3~33.5mm
		High-resolution camera	1.0×0.5mm*4~20mm
Placement speed	Chip	Optimum	23,500CPH
		IPC9850	18,500CPH
	IC*5		9,000CPH *6
Placement accuracy	Laser recognition		±0.05 mm (±3σ)
	Vision recognition		±0.04 mm
Feeder inputs			Max.160 in case of 8mm tape (on a Electric double tape feeder)*7

L-Wide size is optional

Applicability to long PWB is optional.

When using MNVC. (option)

KE-3010 : When using both high-resolution camera and MNVC. (option)

Effective tact : The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board. (CPH=number of components placed for one hour)