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IPC9850 20900CPH Smt Pick And Place Machine JUKI KE-3020V/3020VR

Shenzhen Meraif Import And Export Co., Ltd.
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Address: A1517, Guanhualiantou Commercial Building, West Coast Garden Complex, Jincheng Road, Haoyi Community, Shajing Street, Baoan District, Shenzhen

Contact name:JOY Liang

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Shenzhen Meraif Import And Export Co., Ltd.

IPC9850 20900CPH Smt Pick And Place Machine JUKI KE-3020V/3020VR

Country/Region china
City & Province shenzhen guangdong
Categories Electronics Production Machinery
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Product Details

JUKI KE-3020V/3020VR smt pick and place machine/led pick and place machine/smd pick and place machine

 

led pick and place machine Specification:

High-speed general-purpose placement machine KE-3020V/3020VR, faster, higher quality, improved production performance, continuous improvement of KE series products, so as to achieve a flexible high-speed and high-quality electric production line structure.

Chip components: 20,900CPH chip (laser recognition/best condition) 17,100CPH chip (laser recognition/based on IPC9850)

IC components: 9,470CPH (image recognition / using MNVC)

0402 (Inch 01005) chip~74mm square element, or 50×150mm

KE-3020V: Laser placement head × 1 (6 nozzles) + high resolution visual placement head × 1 (1 nozzle)

KE-3020VR: Laser placement head × 1 (6 nozzles) + 1 IC placement head with FMLA (1 nozzle)

It adopts electric double-track feeder, which can load up to 160 kinds of components.

MNVC is installed as standard

High-speed continuous image recognition

Pallet high-speed supply components (option)

Corresponding to long size substrate (option)

Corresponding to PoP implementation (option)

 

 

Substrate size:
M type substrate (330mm×250mm)
L-type substrate (410mm×360mm)
L-Wide type substrate (510×360mm)*1
XL type substrate (610mm×560mm)
To
Long substrate (L-shaped substrate specification) *2,800×360mm
Long board (L-Wide type board specification)*2 1,010×360mm
Long substrate (XL type substrate specification) *2, 1,210×560mm

Component height: 12mm specifications, 20mm specifications, 25mm specifications (XL type substrate specifications)

Component size: laser recognition, 0402 (English 01005) chip ~ 33.5mm square component

Image recognition: standard camera, 3mm~74mm square element, or 50×150mm

High-resolution cameras (all optional): 1.0mm×0.5mm*3~48mm square element, or 24×72mm

Component placement speed: chip components, best conditions: 20,900CPH
IPC9850 17,100CPH, IC component *4, 9,470CPH *5
Component placement accuracy: laser recognition, ±0.05mm (Cpk≧1)
Image recognition: ±0.03mm (MNVC±0.04mm)
Component placement types: up to 160 types
(Converted to 8mm tape (when using an electric dual-track tape feeder)) *6

 

led pick and place machine  picture show:

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