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Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact name:Ivy Deng
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Introducing our newly shipped RF PCB based on RO3203 High Frequency Circuit Materials. RO3203 is a ceramic-filled laminate reinforced with woven fiberglass. These materials have been meticulously engineered to deliver outstanding electrical performance and mechanical stability at competitive prices. As an extension of the renowned RO3000 Series High Frequency Circuit Materials, the RO3203 stands out with its improved mechanical stability. With a dielectric constant of 3.02 and a dissipation factor of 0.0016, this material expands the useful frequency range beyond 40 GHz.
The RO3203 features Rogers' ceramic-filled PTFE composites, ensuring reliable and high-performance circuitry. With a dielectric constant of 3.02+/- 0.04 at 10 GHz/23°C and a dissipation factor of 0.0016 at 10 GHz/23°C, it guarantees precise and accurate signal transmission. The material can withstand temperatures exceeding 500°C (Td> 500°C) and boasts a thermal conductivity of 0.87 W/mK. Its coefficient of thermal expansion ranges from -55 to 288 °C, with 13 ppm/°C for the X and Y axes and 58 ppm/°C for the Z axis. Additionally, this product is lead-free process compatible and has a 94V-0 flammability rating.
| RO3203 Typical Value | |||||
| Property | RO3203 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.02±0.04 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Dissipation Factor,tanδ | 0.0016 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Conductivity | 0.47 (3.2) | W/mK | Float 100℃ | ASTM C518 | |
| Volume Resistivity | 107 | MΩ.cm | A | ASTM D257 | |
| Surface Resistivity | 107 | MΩ | A | ASTM D257 | |
| Dimensional Stability | 0.08 | X, Y | mm/m +E2/150 | after etch | IPC-TM-650 2.4.3.9 |
| Tensile Modulus | X Y | kpsi | RT | ASTM D638 | |
| Flexural Modulus | 400 300 | X Y | kpsi | A | ASTM D790 |
| Tensile Strength | 12.5 13 | X Y | kpsi | RT | ASTM D638 |
| Flexural Strength | 9 8 | X Y | kpsi | A | ASTM D790 |
| Moisure Absorption | <0.1 | % | D24/23 | IPC-TM-650 2.6.2.1 | |
| Coefficient of Thermal Expansion | 58 13 | Z X,Y | ppm/℃ | -50 ℃to 288℃ | ASTM D3386 |
| Td | 500 | ℃ | TGA | ASTM D3850 | |
| Density | 2.1 | gm/cm3 | 23℃ | ASTM D792 | |
| Copper Peel Stength | 10 (1.74) | lbs/in (N/mm) | After solder | IPC-TM-650 2.4.8 | |
| Flammability | V-0 | UL 94 | |||
| Lead-Free Process Compatible | Yes | ||||
The woven glass reinforcement enhances the RO3203's rigidity, making it easier to handle during assembly. This material exhibits uniform electrical and mechanical performance, making it ideal for complex multi-layer high-frequency structures. With its low dielectric loss, it excels in applications surpassing 20 GHz. The low in-plane expansion coefficient, which matches copper, allows for reliable surface-mounted assemblies and compatibility with epoxy multi-layer board hybrid designs. The excellent dimensional stability of the RO3203 ensures high production yields, while its economical pricing makes it perfect for cost-effective volume manufacturing. Its surface smoothness enables finer line etching tolerances.
This PCB is a 2-layer rigid board with a stackup consisting of a 35 μm copper layer, a 60mil (1.524mm) Rogers RO3203 substrate, and another 35 μm copper layer. Its dimensions are 65mm x 42mm, and it adheres to IPC-Class-2 standards. The minimum trace/space is 5/6 mils, and the minimum hole size is 0.45mm. The finished board thickness is 1.6mm, with a 1 oz (1.4 mils) outer layer copper weight. The via plating thickness is 20 μm, and the surface finish is immersion gold.
| PCB Material: | Ceramic-filled Laminates Reinforced with Woven Fiberglass |
| Designation: | RO3203 |
| Dielectric constant: | 3.02±0.04 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
The PCB comes without top or bottom silkscreen or solder mask. It undergoes a rigorous 100% electrical test before shipment, ensuring its reliability. The artwork supplied is in Gerber RS-274-X format. With worldwide availability, this PCB is ready to meet your needs regardless of your location.
The RO3203 High Frequency Circuit Materials find applications in various industries. They are well-suited for automotive collision avoidance systems, automotive global positioning satellite antennas, wireless telecommunications systems, microstrip patch antennas for wireless communications, direct broadcast satellites, datalink on cable systems, remote meter readers, power backplanes, LMDS and wireless broadband, and base station infrastructure.
Choose the RO3203 High Frequency Circuit Materials for exceptional electrical performance, mechanical stability, and cost-effective volume manufacturing. Experience reliable and high-frequency circuitry with this superior PCB material.
