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Liquid Photosensitive Solder Mask Etch Resist Red Solder Mask

Hubei Nuojin Sen Technology Co.,Ltd
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[China] country

Address: 29th floor room 15 No.5 Commercial building B block ,the 2nd section Wuchang Fu west,No.32 Wenzhi street,Hongshan district,Wuhan city,China

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Hubei Nuojin Sen Technology Co.,Ltd

Liquid Photosensitive Solder Mask Etch Resist Red Solder Mask

Country/Region china
City & Province wuhan hubei
Categories Welding Helmets
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Product Details

Liquid photo image pcb ink ,red color,plastic packing for export

 

ItemsTechnical featuresNotes
ColorRed 
Viscosity (25℃)10±2dPa﹒sVT-04F
Fineness≤5µm0 ~25µm Fineness gauge
Solid content50±5% 
Density (25℃)1.10 ~1.20 g/ml 
Resolution50µm (2.0mil) 
Adhesion100/100Laceration experiment
Plating resistanceCopper ,Tin ,Nickle and AurumNormal plating technics
Hardness≥2HPencil harder
EtchingAcidic/Alkaline etching solution 
Pre-baking limit75℃, 60min 
Package5.0kg/bucket , 20kg/boxAccording to customer requirements
Shelf time6 months since the date of manufactureStore below 25℃ in dark

 

Working procedure

1. Mixing

Mixing a small amount main agent with hardener and stirring thoroughly,then mixing the mixture above with the remanent main agent,add appropriate diluent and stirring 5-10 minutes. The viscosity of ink is adjusted to 120 PS if printed by hand. And it is adjusted to 180 PS if printed by machine.It is adjusted to 200 PS if it is aluminum tamponade .The viscosity of ink mixed above is measured at 25 degrees. Please use the special diluent of our company if the viscosity of ink needs to adjust.

  • Remain time

10-15 minutes after stiring uniformly

  • Ordinary boards:43T;Chemical-plating Aurum or Tin boards:36T
  • Pre-baking

1) Single side printing separately

First side:72-76 degrees,15-18 min

Second side:72-76 degrees,30-35 min

  • Double sides printing simultaneously:72-76 degrees,40-60min
  • Exposure

300-500mJ/cm2,Black ink:600-750mJ/cm2,exposure step:10-12 steps

  • Developing:

Developing solution:0.8-1.2wt% Na2CO3 or K2CO3 aqueous solution

Developing solution temperature:28-32 degrees

Spray pressure:1.5-2.5kg/cm2

Developing time:40-90 seconds

  • Post cure

Spray Tin board:150 degrees*(60-120min)

Chemical-plating Aurum board:150 degrees*(50-60min)

Thick copper plate,boards printed with black ink should be post-black in subsection:75 degrees*(60-120min)+100 degrees*30 min+150 degrees*(60-90min)

  • Safe time

6 months since the date of manufacture,store below 25 degree in dark

  • Attention:

1) Mixing the ink fully before using

2) We will offer you special diluent or PMA if the ink need dilute

3) The values above are based on experiments in our lab.Experiments need to be carried out in order to get proper using condition.

 

 

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