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TLX-8 Panasonic M6 Ceramic FR28 PCB Board Service Blind Slot Buried Copper Block

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[China]

Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

Contact name:Mank.Li

Shenzhen Chaosheng Electronic Technology Co.,Ltd

TLX-8 Panasonic M6 Ceramic FR28 PCB Board Service Blind Slot Buried Copper Block

Country/Region	china
City & Province	hong kong hong kong
Categories	Connectors

Product Details

Product field: military products

18 layers high speed material TLX-8+ Panasonic M6+ ceramic FR28, blind slot + buried copper block + back hole + controlled deep drilling + blind hole, resin filling + plating filling, line width line spacing 4/4mil, differential impedance ±10%, finished plate thickness 10.0mm, hole depth ratio 30:1

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

We are reliable and competitive manufacturer of PCBs with advanced technology,experienced workers,professional salesteam and competitive prices and high quality,we mainly specialize in 1 layer,2 layers,4 layers to 10 layers,60 layersHDI,we offer HAL,OSP,immersion gold,etc,no MOQ , rosh compliant, all we need is your gerber file and quantity,then we will quote best price and do best for you,it is very easy,welcome to inquire anytime, tks for your interest.

pcb board

Process parameters:

Content	Capability
Material	FR4, TG130, TG140, TG160, TG170 TG180 TG240
Surface treatment	HASL,Chemical Tin,ENIG(Immersion GOLD),OSP,IMT,Plating silver,GOLD Finger
Layers	Single-sided,double-sided,4 layers, 6,8,10,20 30 40 60 Layers
Maxi. board size	800mmX508mm
Line width/space	0.1mm/ 0.1mm
Board thickness	0.2mm-4mm
Min.tolerance of Board thickness	+/-8% - 10%
Copper foil thickness	Out Layer:17.5um/35um/70um/105um/140um/175um Inner Layer:17.5um/35um/70um/105um/140um


Outline Tolerance	CNC routing:+/-0.1mm , Punching: +/-0.1mm
V-CUT registration	+/-0.15mm
PTH hole copper thickness	15um-50um
Warp and twist	<=1%
Min registration of hole position	+/-3mil(+/-0.76mm)
Min punching hole	0.8mm(Board thickness below 1.0mm .)
Min Punching Square slot	(Board thickness below 1.0mm, 1.0mmX1.0mm)
Registration of printed circuit	+/-0.076mm
Min drill hole diameter	0.2mm
Min tolerance of hole diameter	+/-0.05mm
Thickness of surface treatment	Plating Gold:(Ni4um-6um ,Au 0.1um-0.5um) Immersion GOLD: (Ni 5um-6um,Au:0.0254um-0.127um) Plating Silver:(Ag 5um-8um)


V-CUT degree tolerance	+/-5(degree)
V-CUT Board thickness	0.6mm-3.2mm
Min Legend width	0.1mm
Min Solder mask width	0.1mm
Min Solder mask ring	0.05mm

Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements

Quick Detail:

1. PCB Assembly on SMT and DIP

2. PCB schematic drawing/ layout /producing

3. PCBA clone/change board

4. Components sourcing and purchasing for PCBA

5. Enclosure design and plastic injection molding

6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,

7. IC programming

Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray

PCB, FPC product application field

Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

Tag:

electronic assembly services,

electronic pcb assembly

PCB, FPC process production capability

Technical ltem		MassProduct	Advanced Technology
		2016	2017	2018
Max.Layer Count		26L	36L	80L
Through-hole plate		2～45L	2～60L	2～80L
Max.PCBSize(in)		24*52"	25*62"	25*78.75"
The layer number of FPC		1～36L	1～50L	1～60L
Max.PCBSize(in)		9.8"*196"	9.8"*196"	10"*196"Reel to reel
Layeredplatelayer		2～12L	2～18L	2～26L
Max.PCBSize(in)		9"*48"	9"*52"	9"*62"
Combination of hard and soft layers		3～26L	3～30L	3～50L
Interconnect HDI		5+X+5Interconnect HDI	7+X+7Interconnect HDI	8+X+8,Interconnect HDI
HDI PCB		4～45L	4～60L	4～80L
Interconnect HDI		3+20+3	4+X+4Interconnect HDI	4+X+4,Interconnect HDI
Max.PCBSize(in)		24"*43"	24"*49"	25"*52"
Material		FR-4 Rogers	FR-4 Rogers	FR-4 Rogers
Base material		Halogenfree,LowDK	Halogenfree,LowDK	Halogenfree,LowDK
Build-up Material		FR-4	FR-4	FR-4
BOard,Thickness(mm)	Min.12L(mm)	0.43	0.42～8.0mm	0.38～10.0mm
	Min.16L(mm)	0.53	1.60～8.0mm	0.45～10.0mm
	Min.18L(mm)	0.63	2.0～8.0	0.51～10.0mm
	Min.52L(mm)	0.8	2.50～8.0mm	0.65～10.0mm
	MAX(mm)	3.5	10.0mm	10.0mm
Min.CoreThickness um(mil)		254"(10.0)	254"(10.0)	0.10～254(10.0mm)
Min.Build up Dielectric		38(1.5)	32(1.3)	25(1.0)
BaseCopperWeight	Inner Layer	4/1-8 OZ	4/1-15 OZ	4/1-0.30mm
	Out Layer	4/1-10 OZ	4/1-15 OZ	4/1-30 OZ
Gold thick		1～40u"	1～60u"	1～120u"
Nithick		76～127u"	76～200u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)

Min. IVH,Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes

viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes

Laser Hole Filling		Yes	Yes	Yes

Technicalltem			Mass Product	Advanced Technolgy
			2017year	2018year	2019year
Drill hole depth ratio		ThroughHole	2017year	.40:1	.40:1
Aspet Ratio		Micro Via	.35:1	1.2:1	1.2:1
Copper Filling Dimple Size um(Mil)			10(0.4)	10(0.4)	10(0.4)
Min.LineWidth＆space		lnner Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
		Plated Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitch mm(Mil)			0.3	0.3	0.3
Min.PTH Hole ring um(mil)			75(3mil)	62.5(2.5mil)	62.5(2.5mil)
Line Width Control		∠2.5MIL	±0.50	±0.50	±0.50
		2.5Mil≤L/W∠4mil	±0.50	±0.50	±0.50
		≦3mil	±0.60	±0.60	±0.60
Laminated structure		Layer by layer	3+N+3	4+N+4	5+N+5
		Sequential Build-up	20L Any Layer	36L Any Layer	52L Any Layer
		Multi-layer overlay	N+N	N+N	N+N
			N+X+N	N+X+N	N+X+N
		sequential Lamination	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
		Soft and hard bonding	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
PTH filling process			PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

PCB, FPC main material supplier

NO	supplier	Supply material name	Material origin
1	Japan	High frequency materials, PI, covering membrane,Copper berth	Mitsubishi Japan
2	dupont	High frequency materials, PI, covering film, dry film,Copper berth	Japan
3	panasonic	High frequency materials, PI, covering membrane,Copper berth	Japan
4	SanTie	PI, covering membrane	Japan
5	Born good	FR-4,PI,PP,Copper berth	shenzhen, China
6	A rainbow	PI, covering membrane,Copper berth	Taiwan
7	teflon	High frequency materials	The United States
8	Rogers	High frequency materials	The United States
9	Nippon Steel	PI, covering membrane,Copper berth	Taiwan
10	sanyo	PI, covering membrane,Copper berth	Japan
11	South Asia	FR-4,PI,PP,Copper berth	Taiwan
12	doosan	FR-4,PP	South Korea
13	Tai Yao plate	FR-4,PP,Copper berth	Taiwan
14	Alight	FR-4,PP,Copper berth	Taiwan
15	Yaoguang	FR-4,PP,Copper berth	Taiwan
16	Yalong	FR-4,PP	The United States
17	ISOAL	FR-4,PP	Japan
18	OAK	Buried, buried resistance, PP	Japan
19	United States 3M	FR-4,PP	The United States
20	Bergs	Copper and aluminum matrix	Japan
21	The sun	ink	Taiwan
22	Murata	ink	Japan
23	generous andbenevolent	PI, covering membrane,Copper berth	China's jiangxi
24	Yasen	PPI, covering membrane	China jiangsu
25	Yong Sheng Tai	ink	China guangdong panyu
26	mita	ink	Japan
27	Transcript	ceramic material	Taiwan

28	HOME	ceramic material	Japan

29	Fe-Ni-Mn	Alloy Invar, Section Steel	Taiwan

Contact Us

Shenzhen Chaosheng Electronic Technology Co.,Ltd

TLX-8 Panasonic M6 Ceramic FR28 PCB Board Service Blind Slot Buried Copper Block

Product Details

pcb board

electronic assembly services,

electronic pcb assembly

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