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Mid Tg FR4 Flexible Rigid PCB HDI Dielectric / Prepreg Thick HDI Laminate Options

Shenzhen Chaosheng Electronic Technology Co.,Ltd
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Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

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Shenzhen Chaosheng Electronic Technology Co.,Ltd

Mid Tg FR4 Flexible Rigid PCB HDI Dielectric / Prepreg Thick HDI Laminate Options

Country/Region china
City & Province hong kong hong kong
Categories Plastic Sheets
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Product Details

Wiring Density of Thick HDI Laminate Options Mid Tg FR4 HDI Dielectric / Prepreg High Tg FR4 PCB Technologies

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Sunstone Circuits utilizes the following materials for PCB manufacturing:


FOR SOME DESIGNS, PCB DIELECTRIC PROPERTIES
ARE CRITICAL

Whether it's high-speed designs, RF, microwave, or mobile applications - where power management is key, you're finding more situations that require dielectric PCB properties in your prototypes that standard FR-4 just can't deliver. We know that. That's why we have added more materials to our arsenal. One example of these added materials is Rogers 4000-series. These low-loss dielectric materials mean greater performance for your high-demand PCB prototypes or production.

You can get more information on all of Rogers' laminate products here, in the Rogers High Frequency Laminates Product Selector Guide.

Glossary:

Dielectric Materials
A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown. Rogers 4350 is less likely to demonstrate a dielectric breakdown condition than FR-4.
Pre-impregnated (Pre-preg)
Contraction of "pre-impregnated composite fibers", and in the manufacture of PCBs, pre-pregs help influence the performance characteristics of the printed circuit board.

A term also used in the PCB fabrication industry to describe the bonding ply materials used to bond the layers of a multilayer PCB together.

A thin prepreg layer is the most common HDI substrate. It provides good reliability, process-ability and reasonable cost.

Typical thickness of prepreg HDI layer is 60u +/-20u. Typical laser hole diameter (drilled top) is 100 - 150u.

Another option is RCCu (Resin coated copper foil) which is used in applications that require extremely good drop test performance. Aspocomp has process capability for halogen-free RCCu and stock of 50,60 and 75u RCCu. Please check case by case the availability of RCCu.

Detailed Specification of Flexible PCB Manufacturing

Technical Specification
Layers:2~106(flex Pcb) and 2~10 (rigid flex) 
Min Panel Size:5mm x 8mm 
Max Panel Size:250 x 520mm 
Min Finished board thickness:0.05mm (1 sided inclusive copper) 
Max Finished board thickness:0.3mm (2 sided inclusive copper) 
Finished board thickness tolerance:±0.02~0.03mm 
Material:Kapton, Polyimide, PET 
Base copper thickness (RA or ED):1/3 oz, 1/2 oz, 1oz, 2oz 
Base PI thickness:0.5mil, 0.7mil, 0.8mil, 1mil, 2mil 
Stiffner:Polyimide, PET, FR4, SUS 
Min Finished hole diameter:Φ 0.15mm 
Max Finished hole diameter:Φ 6.30mm 
Finished hole diameter tolerance (PTH):±2 mil ( ±0.050mm) 
Finished hole diameter tolerance (NPTH):±1 mil ( ±0.025mm) 
Min width/spacing (1/3oz):0.05mm/0.06mm 
Min width/spacing (1/2oz):0.06mm/0.07mm 
Min width/spacing (1oz):Single layer: 0.07mm/0.08mm 
Double layer: 0.08mm/0.09mm 
Aspect Ratio6:018:01
Base Copper1/3Oz--2Oz3 Oz for Prototype
Size ToleranceConductor Width:±10%W ≤0.5mm
Hole Size: ±0.05mmH ≤1.5mm
Hole Registration: ±0.050mm 
Outline Tolerance:±0.075mmL ≤50mm
Surface TreatmentENIG: 0.025um - 3um 
OSP: 
Immersion Tin: 0.04-1.5um 
Dielectric StrengthAC500V 
Solder Float288℃/10sIPC Standard
Peeling Strength1.0kgf/cmIPC-TM-650
Flammability94V-OUL94


Quality Assurance:
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
Quick Detail:
1. PCB Assembly on SMT and DIP
2. PCB schematic drawing/ layout /producing
3. PCBA clone/change board
4. Components sourcing and purchasing for PCBA
5. Enclosure design and plastic injection molding
6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,
7. IC programming :
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products
Surface treatment: full board OSP, full board immersion gold, whole board electric nickel gold, electric gold + immersion gold, electric gold + OSP, OSP + immersion gold, OSP + carbon bridge, gold finger, OSP + gold finger, immersion gold + gold finger, Shen tin, immersion silver, lead-free tin spray:
FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?

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