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1.6mm Thickness Printed Circuit Board Services 8 Layer Carbon Oil FR4 TG 150

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Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong

Contact name:Mank.Li

Shenzhen Chaosheng Electronic Technology Co.,Ltd

1.6mm Thickness Printed Circuit Board Services 8 Layer Carbon Oil FR4 TG 150

Country/Region	china
City & Province	hong kong hong kong
Categories	Solar Lamps

Product Details

8-layer carbon oil + FR4 TG 150, type PCB, printed circuit board pcb multilayer pcb board Contact PCB PCBway-The PCB

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

8 layer FR4 Multilayer PCB with ENIG surface finish,1.6mm board thickness with 2.0oz copper thickness for communication products.

PRODUCT’S DETAILS
Raw Material	FR-4 (Tg 180 available)
Layer Count	8-Layer
Board Thickness	1.6mm
Copper Thickness	2.0oz
Surface Finish	ENIG(Electroless Nickel Immersion Gold)
Solder Mask	Green
Silkscreen	White
Min. Trace Width/Spacing	0.075/0.075mm
Min. Hole Size	0.25mm
Hole Wall Copper Thickness	≥20μm
Measurement	300×400mm
Packaging	Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps
Application	Communication,automobile,cell,computer,medical
Advantage	Competitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special Requirements	Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable
Certification	UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB
Process Engineering	Items	Manufacturing Capability
Laminate	Thickness	0.2～3.2mm
Production Type	Layer Count	2L-16L
Cut Lamination	Max. Working Panel size	1000×1200mm
Inner Layer	Internal Core Thickness	0.1～2.0mm
	Internal width/spacing	Min: 4/4mil
	Internal Copper Thickness	1.0~3.0oz
Dimension	Board Thickness Tolerance	±10%
Dimension	Interlayer Alignment	±3mil
Drilling	Manufacture Panel Size	Max: 650×560mm
	Drilling Diameter	≧0.25mm
	Hole Diameter Tolerance	±0.05mm
	Hole Position Tolerance	±0.076mm
	Min.Annular Ring	0.05mm
PTH+Panel Plating	Hole Wall copper Thickness	≧20um
PTH+Panel Plating	Uniformity	≧90%
Outer Layer	Track Width	Min: 0.08mm
Outer Layer	Track Spacing	Min: 0.08mm
Pattern Plating	Finished Copper Thickness	1oz～3oz
EING/Flash Gold	Nickel Thickness	2.5um~5.0um
EING/Flash Gold	Gold Thickness	0.03~0.05um
Solder Mask	Thickness	15～35um
Solder Mask	Solder Mask Bridge	3mil
Legend	Line width/Line spacing	6/6mil
Gold Finger	Nickel Thickness	≧120u〞
Gold Finger	Gold Thickness	1～50u〞
Hot Air Level	Tin Thickness	100～300u〞
Routing	Tolerance of Dimension	±0.1mm
	Slot Size	Min:0.4mm
	Cutter Diameter	0.8～2.4mm
Punching	Outline Tolerance	±0.1mm
Punching	Slot Size	Min:0.5mm
V-CUT	V-CUT Dimension	Min:60mm
	Angle	15°30°45°
	Remain Thickness Tolerance	±0.1mm
Beveling	Beveling Dimension	30～300mm
Test	Testing Voltage	250V
Test	Max.Dimension	540×400mm
Impedance Control	Tolerance	±10%
Aspect Ration		12:1
Laser Drilling Size		4mil(0.1mm)

Product Tags:

multilayer pcb board

Quality ITEQ 8 Layer PCB FR 4 Multi Layer PCB With 2.0oz Copper Thickness For Automobile for sale

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

1: Medical Bluetooth module motherboard
2: Halogen-free FR-4 TG180, inner and outer copper thickness 35um, minimum line width line spacing 3/3mil, hole ratio 10:1, minimum hole 0.10mm, blind hole buried hole, immersion gold, red solder resist, white
3: The board thickness is 1.60mm,
4: blind hole, resin plug hole + plating hole
Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
Standard.
Quantities range from prototype to volume production.
100% E-Test

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

Technical ltem		MassProduct	Advanced Technology
		2016	2017	2018
Max.Layer Count		26L	36L	80L
Through-hole plate		2～45L	2～60L	2～80L
Max.PCBSize(in)		24*52"	25*62"	25*78.75"
The layer number of FPC		1～36L	1～50L	1～60L
Max.PCBSize(in)		9.8"*196"	9.8"*196"	10"*196"Reel to reel
Layeredplatelayer		2～12L	2～18L	2～26L
Max.PCBSize(in)		9"*48"	9"*52"	9"*62"
Combination of hard and soft layers		3～26L	3～30L	3～50L
Interconnect HDI		5+X+5Interconnect HDI	7+X+7Interconnect HDI	8+X+8,Interconnect HDI
HDI PCB		4～45L	4～60L	4～80L
Interconnect HDI		3+20+3	4+X+4Interconnect HDI	4+X+4,Interconnect HDI
Max.PCBSize(in)		24"*43"	24"*49"	25"*52"
Material		FR-4 Rogers	FR-4 Rogers	FR-4 Rogers
Base material		Halogenfree,LowDK	Halogenfree,LowDK	Halogenfree,LowDK
Build-up Material		FR-4	FR-4	FR-4
BOard,Thickness(mm)	Min.12L(mm)	0.43	0.42～8.0mm	0.38～10.0mm
	Min.16L(mm)	0.53	1.60～8.0mm	0.45～10.0mm
	Min.18L(mm)	0.63	2.0～8.0	0.51～10.0mm
	Min.52L(mm)	0.8	2.50～8.0mm	0.65～10.0mm
	MAX(mm)	3.5	10.0mm	10.0mm
Min.CoreThickness um(mil)		254"(10.0)	254"(10.0)	0.10～254(10.0mm)
Min.Build up Dielectric		38(1.5)	32(1.3)	25(1.0)
BaseCopperWeight	Inner Layer	4/1-8 OZ	4/1-15 OZ	4/1-0.30mm
	Out Layer	4/1-10 OZ	4/1-15 OZ	4/1-30 OZ
Gold thick		1～40u"	1～60u"	1～120u"
Nithick		76～127u"	76～200u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)

Min. IVH,Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes

viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes

Laser Hole Filling		Yes	Yes	Yes

Technicalltem			Mass Product	Advanced Technolgy
			2017year	2018year	2019year
Drill hole depth ratio		ThroughHole	2017year	.40:1	.40:1
Aspet Ratio		Micro Via	.35:1	1.2:1	1.2:1
Copper Filling Dimple Size um(Mil)			10(0.4)	10(0.4)	10(0.4)
Min.LineWidth＆space		lnner Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
		Plated Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitch mm(Mil)			0.3	0.3	0.3
Min.PTH Hole ring um(mil)			75(3mil)	62.5(2.5mil)	62.5(2.5mil)
Line Width Control		∠2.5MIL	±0.50	±0.50	±0.50
		2.5Mil≤L/W∠4mil	±0.50	±0.50	±0.50
		≦3mil	±0.60	±0.60	±0.60
Laminated structure		Layer by layer	3+N+3	4+N+4	5+N+5
		Sequential Build-up	20L Any Layer	36L Any Layer	52L Any Layer
		Multi-layer overlay	N+N	N+N	N+N
			N+X+N	N+X+N	N+X+N
		sequential Lamination	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
		Soft and hard bonding	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
PTH filling process			PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

Technical ltem		MassProduct	Advanced Technology
		2016	2017	2018
Max.Layer Count		26L	36L	80L
Through-hole plate		2～45L	2～60L	2～80L
Max.PCBSize(in)		24*52"	25*62"	25*78.75"
The layer number of FPC		1～36L	1～50L	1～60L
Max.PCBSize(in)		9.8"*196"	9.8"*196"	10"*196"Reel to reel
Layeredplatelayer		2～12L	2～18L	2～26L
Max.PCBSize(in)		9"*48"	9"*52"	9"*62"
Combination of hard and soft layers		3～26L	3～30L	3～50L
Interconnect HDI		5+X+5Interconnect HDI	7+X+7Interconnect HDI	8+X+8,Interconnect HDI
HDI PCB		4～45L	4～60L	4～80L
Interconnect HDI		3+20+3	4+X+4Interconnect HDI	4+X+4,Interconnect HDI
Max.PCBSize(in)		24"*43"	24"*49"	25"*52"
Material		FR-4 Rogers	FR-4 Rogers	FR-4 Rogers
Base material		Halogenfree,LowDK	Halogenfree,LowDK	Halogenfree,LowDK
Build-up Material		FR-4	FR-4	FR-4
BOard,Thickness(mm)	Min.12L(mm)	0.43	0.42～8.0mm	0.38～10.0mm
	Min.16L(mm)	0.53	1.60～8.0mm	0.45～10.0mm
	Min.18L(mm)	0.63	2.0～8.0	0.51～10.0mm
	Min.52L(mm)	0.8	2.50～8.0mm	0.65～10.0mm
	MAX(mm)	3.5	10.0mm	10.0mm
Min.CoreThickness um(mil)		254"(10.0)	254"(10.0)	0.10～254(10.0mm)
Min.Build up Dielectric		38(1.5)	32(1.3)	25(1.0)
BaseCopperWeight	Inner Layer	4/1-8 OZ	4/1-15 OZ	4/1-0.30mm
	Out Layer	4/1-10 OZ	4/1-15 OZ	4/1-30 OZ
Gold thick		1～40u"	1～60u"	1～120u"
Nithick		76～127u"	76～200u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)

Min. IVH,Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)

DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes

viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes

Laser Hole Filling		Yes	Yes	Yes

Technicalltem			Mass Product	Advanced Technolgy
			2017year	2018year	2019year
Drill hole depth ratio		ThroughHole	2017year	.40:1	.40:1
Aspet Ratio		Micro Via	.35:1	1.2:1	1.2:1
Copper Filling Dimple Size um(Mil)			10(0.4)	10(0.4)	10(0.4)
Min.LineWidth＆space		lnner Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
		Plated Layer um(mil)	45/45(1.8/1.8)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitch mm(Mil)			0.3	0.3	0.3
Min.PTH Hole ring um(mil)			75(3mil)	62.5(2.5mil)	62.5(2.5mil)
Line Width Control		∠2.5MIL	±0.50	±0.50	±0.50
		2.5Mil≤L/W∠4mil	±0.50	±0.50	±0.50
		≦3mil	±0.60	±0.60	±0.60
Laminated structure		Layer by layer	3+N+3	4+N+4	5+N+5
		Sequential Build-up	20L Any Layer	36L Any Layer	52L Any Layer
		Multi-layer overlay	N+N	N+N	N+N
			N+X+N	N+X+N	N+X+N
		sequential Lamination	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
		Soft and hard bonding	2+(N+X+N)+2	2+(N+X+N)+2	2+(N+X+N)+2
PTH filling process			PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole	PTH resin plug hole + plating fill Electroplated hole/copper plug hole

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Product Details

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