Red Solder Mask High Layer PCB OSP Multilayer Printed Circuit Board

Product Description:

High Layer PCB, also known as High-tier printed circuit boards, are advanced circuit boards that are designed with multiple layers of conductive materials and insulating layers. These high rank PCBs have become an essential component in various electronic devices, providing a reliable and efficient platform for the electronic components to connect and communicate with each other.

High Layer PCBs are commonly used in complex electronic devices such as smartphones, computers, and medical equipment. They are designed with high precision and accuracy to meet the demanding requirements of these devices, making them an integral part of the modern technology industry.

High Layer PCBs are designed with multiple layers, typically ranging from 4 to 20 layers, depending on the complexity of the electronic device. These layers are stacked together with insulating materials in between, creating a compact and efficient design that allows for high-speed signal transmission and reduces electromagnetic interference.

Impedance control is a critical feature in High Layer PCBs, as it ensures the stability and consistency of the electrical signals traveling through the board. With precise impedance control, the electronic components can function at their optimal performance, resulting in a high-quality and reliable electronic device.

Copper is the most commonly used conductive material in PCBs, and its thickness is an important factor in determining the board's performance. High Layer PCBs offer a wide range of copper thickness options, from 1/3 oz to 2 oz, allowing for flexibility in design and meeting the specific needs of different electronic devices.

The thickness of the PCB board is crucial in determining its durability and rigidity. High Layer PCBs are designed with a range of board thickness options, from 0.2mm to 6.0mm, to provide the necessary strength and stability for the electronic device. This also allows for customization to meet the specific requirements of the device.

Solder mask is a protective layer applied on the PCB to prevent short circuits and corrosion. The minimum solder mask clearance of 0.1mm in High Layer PCBs ensures that the solder mask is accurately applied without any interference with the electrical components, providing a smooth and reliable surface for the components to be soldered onto.

• Layer Count: High Layer
• Impedance Control: Yes
• Copper Thickness: 1/3 Oz To 2 Oz
• Board Thickness: 0.2mm To 6.0mm
• Min. Solder Mask Clearance: 0.1mm

In conclusion, High Layer PCBs are an essential component in modern electronic devices, providing a compact, efficient, and reliable platform for electronic components to communicate and function. With features such as impedance control, copper thickness options, and precise solder mask clearance, High Layer PCBs offer high performance and flexibility to meet the demanding requirements of various electronic devices.

Features:

• Product Name: High layer PCB
• High-level PCB circuit
• High-tier printed circuit boards
• High layer count
• Advanced circuit technology
• Min. Silkscreen Clearance: 0.15mm
• Board Thickness: 0.2mm To 6.0mm
• Surface Finish:
  • HASL
  • ENIG
  • OSP
  • Immersion Silver
  • Immersion Tin
• Rohs Compliant: Yes
• Min. Line Width/Spacing: 3mil/3mil

Technical Parameters:

Applications:

High layer PCB, also known as high layer printed boards, refers to a type of printed circuit board with a high number of layers. These high layer boards are designed to meet the growing demand for smaller, lighter, and more complex electronic devices. They are commonly used in various industries such as telecommunications, medical, aerospace, and military. The following are the key features of high layer PCB:

High layer PCBs are characterized by their high number of layers, ranging from 8 to 50 layers or more. This allows for a higher density of components and more complex circuit designs, making them ideal for high-performance electronic devices. The layers are connected through vias, which enable the transmission of signals and power between different layers.

High layer PCBs can be finished with a variety of surface finishes, depending on the specific application and requirements. The most common surface finishes include HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), Immersion Silver, and Immersion Tin. These finishes provide a protective layer on the copper traces and pads, preventing corrosion and ensuring good solderability.

The solder mask is a thin layer of polymer applied over the copper traces to protect them from oxidation and to prevent solder bridges during the soldering process. In high layer PCBs, a minimum solder mask clearance of 0.1mm is required to ensure proper insulation between closely spaced traces and pads.

The line width and spacing refer to the minimum distance between two copper traces on a PCB. In high layer PCBs, the minimum line width and spacing are typically 3mil/3mil, allowing for more compact and complex circuit designs. This also requires advanced manufacturing techniques and precision equipment to achieve such small dimensions.

High layer PCBs are available in a wide range of board thicknesses, from 0.2mm to 6.0mm. This allows for flexibility in design and the ability to accommodate different types of components and connectors. Thinner boards are suitable for compact devices, while thicker boards are used for high-power applications.

High layer PCBs find extensive use in various industries and applications, including:

• Telecommunications: With the increasing demand for high-speed data transfer and wireless communication, high layer PCBs are used in the production of routers, switches, base stations, and other network equipment.
• Medical: High layer PCBs are used in medical devices such as MRI machines, ultrasound equipment, and patient monitoring systems due to their high precision and reliability.
• Aerospace and Military: These industries require high-performance and reliable electronic devices for communication, navigation, and defense systems. High layer PCBs are used to meet these requirements and withstand harsh environments.
• Consumer Electronics: The demand for smaller and more advanced electronic devices, such as smartphones, tablets, and wearable technology, has led to the use of high layer PCBs in their production.

In conclusion, high layer PCBs are a crucial component in the development of advanced electronic devices. Their high layer count, advanced technology, and flexibility make them suitable for various applications and scenarios, driving innovation and progress in the electronics industry.

Customization:

At High-Tier Printed Circuit Boards, we offer high-level PCB circuit boards with customizable options to meet your specific requirements. Our experienced team is dedicated to providing you with the highest quality products and services.

• Min. Solder Mask Clearance: 0.1mm
• Rohs Compliant: Yes
• Board Thickness: 0.2mm to 6.0mm
• Silkscreen Color: White, Black, Yellow
• Min. Line Width/Spacing: 3mil/3mil

Our customized service allows you to personalize your high-layer printed circuit boards according to your unique needs. You can choose from a variety of options to create a PCB that meets your specific requirements, including:

• Customized board thickness
• Choice of silkscreen color
• Customized solder mask clearance
• Choice of line width and spacing
• Compliance with Rohs standards

With our customized service, you can be assured that your high-level PCB circuit boards will be tailored to your exact specifications, ensuring the highest quality and performance.

Choose High-Tier Printed Circuit Boards for your high-level PCB needs and experience our top-notch customized service. Contact us today to learn more!

Packing and Shipping:

Thank you for choosing our High layer PCB. To ensure the safe delivery of your product, we have carefully designed our packaging and shipping process. Our goal is to provide you with a hassle-free experience and to deliver your product in perfect condition.

Our High layer PCBs are packaged using high-quality materials to protect them from any potential damage during transportation. They are first placed in anti-static bags to prevent any electrostatic discharge, which may harm the delicate components of the PCB. The bags are then sealed and placed in a sturdy cardboard box with ample cushioning material to absorb any shock or impact during transit.

We also offer customized packaging options for bulk orders or specific requirements. Please contact our customer service team for more information.

We work with reputable shipping companies to ensure the timely and secure delivery of your High layer PCB. Our standard shipping method is through air freight, with an estimated delivery time of 5-7 business days. For urgent orders, we also offer express shipping options at an additional cost.

Once your order has been shipped, we will provide you with a tracking number so you can monitor the status of your package. Please note that any customs or import duties may apply and will be the responsibility of the recipient.

Upon receiving your High layer PCB, please carefully inspect the package for any signs of damage. If you notice any, please take photos and contact us immediately. We will work with you to resolve any issues and ensure your satisfaction.

Thank you again for choosing our High layer PCB. We value your business and strive to provide you with the best products and services. If you have any further questions or concerns, please do not hesitate to reach out to us.

FAQ:

• High layer PCB is mainly used in the design and production of complex electronic circuits, such as high-speed communication equipment, computer motherboards, and medical equipment.

• High layer PCB allows for more components and connections to be placed on a single board, which increases the overall functionality of the circuit.
• It also allows for smaller and more compact designs, making it suitable for devices with limited space.
• The multiple layers also provide improved signal integrity and reduced electromagnetic interference.
• High layer PCB can handle higher power and operates at higher frequencies, making it ideal for high-performance applications.
• It offers better thermal management, which is essential for circuits that generate a lot of heat.

• The most commonly used material for High layer PCB is FR-4, a type of glass-reinforced epoxy laminate.
• Other materials such as polyimide and PTFE can also be used for specialized applications.
• The conductive layers are typically made of copper, with varying thicknesses and surface finishes.
• Solder mask and silkscreen are used for protection and labeling of the PCB.
• High layer PCB may also include additional materials such as heat sinks and stiffeners for added functionality and durability.

• The manufacturing process of High layer PCB involves several steps, including designing the circuit layout, printing the circuit pattern on the layers of the board, and etching away the excess copper to create the required connections.
• The layers are then laminated together with adhesive and heat, and holes are drilled for component placement.
• The board is then coated with solder mask and silkscreen, and the final finish is applied to the surface of the copper layers.
• The boards are then tested, inspected, and assembled with components to create the final product.
• The entire process is highly automated and requires advanced machinery and skilled technicians.

• The number of layers required to accommodate the circuit design and the size of the board are essential factors to consider.
• The type and density of components and the required signal integrity also play a crucial role in the design process.
• Thermal management and power handling capabilities should also be taken into account.
• Additionally, the manufacturing capabilities and cost should be considered to ensure the design is feasible and cost-effective.
• It is also important to adhere to industry standards and guidelines for safety and reliability.