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AP15N10S Mos Field Effect Transistor / 15A 100V Logic Mosfet Switch

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Shenzhen Hua Xuan Yang Electronics Co.,Ltd

AP15N10S Mos Field Effect Transistor / 15A 100V Logic Mosfet Switch

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Product Details

AP15N10S Mos Field Effect Transistor / 15A 100V Logic Mosfet Switch

 

Mos Field Effect Transistor Introduction

 

Power MOSFETs are normally used in applications where voltages do not exceed about 200 volts. Higher voltages are not so easily achievable. Where the Power MOSFETs are used, it is their low ON resistance that is particularly attractive. This reduces power dissipation which reduces cost and size less metalwork and cooling is required. Also the low ON resistance means that efficiency levels can be maintained at a higher level

 

Mos Field Effect Transistor Features

 

VDS = 100V ID =15A
RDS(ON) < 120mΩ @ VGS=10V

 

Mos Field Effect Transistor Application

 

VDS = 100V ID =15A
RDS(ON) < 120mΩ @ VGS=10V

 

Package Marking and Ordering Information

 

Product IDPackMarkingQty(PCS)
AP15N10SSOP-8AP15N10S XXX YYYY3000

 

Absolute Maximum Ratings (TC=25℃unless otherwise noted)

 

SymbolParameterRatingUnits
VDSDrain-Source Voltage100V
VGSGate-Sou rce Voltage±20V
ID@TA=25℃Continuous Drain Current, V GS @ 10V 115A
ID@TA=70℃Continuous Drain Current, V GS @ 10V 17A
IDMPulsed Drain Current230A
EASSingle Pulse Avalanche Energy 36.1mJ
IASAvalanche Current11A
PD@TA=25 ℃Total Power Dissipation31.5W
TSTGStorage Temperature Range-55 to 150
TJOperating Junction Temperature Range-55 to 150
RθJAThermal Resistance Junction-ambient 185℃/W
RθJCThermal Resistance Junction-Case 136℃/W

 

Electrical Characteristics (TJ=25, unless otherwise noted

 

 

SymbolParameterConditionsMin.Typ.Max.Unit
BVDSSDrain-Source Breakdown VoltageVGS=0V , ID=250uA100------V
△ BVDSS/△TJBVDSS Temperature CoefficientReference to 25℃ , ID=1mA---0.098---V/℃

 

RDS(ON)

 

Static Drain-Source On-Resistance

VGS=10V , I D=2A---90112
VGS=4.5V , ID=1A---95120
VGS(th)Gate Threshold Voltage 1.01.52.5V
      
△VGS(th)VGS(th) Temperature Coefficient ----4.57---mV/℃

 

IDSS

 

Drain-Source Leakage Current

VDS=80V , VGS=0V , TJ=25℃------10

 

uA

VDS=80V , VGS=0V , TJ=55℃------100
IGSSGate-Source Leakage CurrentVGS=±20V , VDS=0V------±100nA
gfsForward TransconductanceVDS=5V , ID=2A---12---S
RgGate ResistanceVDS=0V , VGS=0V , f=1MHz---24 
QgTotal Gate Charge (10V) ---19.5--- 
QgsGate-Source Charge---3.2---
QgdGate-Drain Charge---3.6---
Td(on)Turn-On Delay Time

 

VDD=50V , VGS=10V ,

---16.2--- 
TrRise Time---3---
Td(off)Turn-Off Delay Time---44---
TfFall Time---2.6---
CissInput Capacitance ---1535--- 
CossOutput Capacitance---60---
CrssReverse Transfer Capacitance---37.4---
ISContinuous Source Current 1,5

 

VG=VD=0V , Force Current

------4A
ISMPulsed Source Current 2,5------8A
VSDDiode Forward Voltage2VGS=0V , IS=1A , TJ=25℃------1.2V
SymbolParameterConditionsMin.Typ.Max.Unit
BVDSSDrain-Source Breakdown VoltageVGS=0V , ID=250uA100------V
△ BVDSS/△TJBVDSS Temperature CoefficientReference to 25℃ , ID=1mA---0.098---V/℃

 

RDS(ON)

 

Static Drain-Source On-Resistance

VGS=10V , I D=2A---90112
VGS=4.5V , ID=1A---95120
VGS(th)Gate Threshold Voltage 1.01.52.5V
      
△VGS(th)VGS(th) Temperature Coefficient ----4.57---mV/℃

 

IDSS

 

Drain-Source Leakage Current

VDS=80V , VGS=0V , TJ=25℃------10

 

uA

VDS=80V , VGS=0V , TJ=55℃------100
IGSSGate-Source Leakage CurrentVGS=±20V , VDS=0V------±100nA
gfsForward TransconductanceVDS=5V , ID=2A---12---S
RgGate ResistanceVDS=0V , VGS=0V , f=1MHz---24 
QgTotal Gate Charge (10V) ---19.5--- 
QgsGate-Source Charge---3.2---
QgdGate-Drain Charge---3.6---
Td(on)Turn-On Delay Time

 

VDD=50V , VGS=10V ,

---16.2--- 
TrRise Time---3---
Td(off)Turn-Off Delay Time---44---
TfFall Time---2.6---
CissInput Capacitance ---1535--- 
CossOutput Capacitance---60---
CrssReverse Transfer Capacitance---37.4---
ISContinuous Source Current 1,5

 

VG=VD=0V , Force Current

------4A
ISMPulsed Source Current 2,5------8A
VSDDiode Forward Voltage2VGS=0V , IS=1A , TJ=25℃------1.2V

 

Note :

 

1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.

2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%

3.The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=11A

4.The power dissipation is limited by 175℃ junction temperature

5.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation

 

Attention

 

1, Any and all APM Microelectronics products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your APM Microelectronics representative nearest you before using any APM Microelectronics products described or contained herein in such applications.

2, APM Microelectronics assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all APM Microelectronics products described or contained herein.

3, Specifications of any and all APM Microelectronics products described or contained here instipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment.

4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design,and structural design.

5,In the event that any or all APM Microelectronics products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law.

6, No part of this publication may be reproduced or transmitted in any form or by any means,electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of APM Microelectronics Semiconductor CO., LTD.

7, Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. APM Microelectronics believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties.

8, Any and all information described or contained herein are subject to change without notice due to product/technology improvement,etc. When designing equipment, refer to the "Delivery Specification" for the APM Microelectronics product that you Intend to use.

 

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