Active Member
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[China]
Address: No.5 Building, No.581 Heilong Jiang Road, Li Yu Industrial Park, Tian Yuan District, Zhuzhou, Hunan, P.R. China.
Contact name:Wu
Zhuzhou Jiabang Refractory Metal Co., Ltd |
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CuW75 Chip Carriers, Substrates, Flanges, and Frames For Power
Semiconductor Devices
Description:
W-Cu heat sink material is a composite of tungsten and copper, with
both tungsten low expansion characteristics, but also has copper of
high thermal conductivity properties, and the tungsten and copper
in the thermal expansion coefficient and thermal conductivity can
be adjusted with the W-Cu composition, also the composite can be
machined to various shape.
Advantages:
High thermal conductivity
Excellent hermeticity
Excellent flatness, surface finish, and size control
Semi-finished or finished (Ni/Au plated) products available
Product Properties:
| Grade | W Content | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Thermal conductivity W/(M·K) |
| 90WCu | 90±2% | 17.0 | 6.5 | 180 (25℃) /176 (100℃) |
| 85WCu | 85±2% | 16.4 | 7.2 | 190 (25℃) / 183 (100℃) |
| 80WCu | 80±2% | 15.65 | 8.3 | 200 (25℃) / 197 (100℃) |
| 75WCu | 75±2% | 14.9 | 9.0 | 230 (25℃) / 220 (100℃) |
| 50WCu | 50±2% | 12.2 | 12.5 | 340 (25℃) / 310 (100℃) |
Application:
These composite are widely used in applications such as
Optoelectronics Packages, Microwave Packages, C Packages, Laser
Sub-mounts. etc.
Product picture:
