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$Zhuzhou Jiabang Refractory Metal Co., Ltd$

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[China]

Address: No.5 Building, No.581 Heilong Jiang Road, Li Yu Industrial Park, Tian Yuan District, Zhuzhou, Hunan, P.R. China.

Contact name:Wu

Zhuzhou Jiabang Refractory Metal Co., Ltd

Featured Products: MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION, Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging, Perfect Hermeticity WCu Base Plate For Optical Telecommunication Transmission And Pump Laser Diode Modules and more.

MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION

MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION Description: Molybdenum copper alloy is a composite material of molybdenum and ...

[Last Updated : 2024-04-11]

Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging Description: Molybdenum copper alloy is a composite material of molybdenum ...

[Last Updated : 2024-04-11]

Perfect Hermeticity WCu Base Plate For Optical Telecommunication Transmission And Pump Laser Diode Modules

Perfect Hermeticity WCu Base Plate For Optical Telecommunication Transmission And Pump Laser Diode Modules Description: It is a composite of tungsten and copper. The coefficient of ...

[Last Updated : 2024-04-11]

Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC)

Chip Components Electronic Packaging Materials WCu (CuW) MoCu (CuMo) Cu/Mo/Cu (CMC) Cu/MoCu/Cu (CPC) Descriptions: Packaging materials strongly effect the effectiveness of an ...

[Last Updated : 2024-04-11]

Nickel Plated Gold Plated Free Of Surface Defects WCu, MoCu, CMC, CPC Base Plates Flanges

Nickel Plated Gold Plated Free Of Surface Defects WCu, MoCu, CMC, CPC Base Plates Flanges Descriptions: Packaging materials strongly effect the effectiveness of an electronic ...

[Last Updated : 2024-04-11]

Cu/MoCu/Cu Heat Spreader For Hermetic Packages Electronics RF GaN HEMT

CPC Heat Spreader For Hermetic Packages Electronics RF GaN HEMT Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper ...

[Last Updated : 2024-04-11]

Cu/MoCu/Cu Heat Spreader For Hermetic Packages Electronics RF GaN HEMT

Cu/Mo/Cu Carrier Hermetic Packages Electronics Material CMC Flange

Cu/Mo/Cu carrier Hermetic Packages Electronics Material CMC Flange Description: Cu/Mo/Cu(CMC) carrier, also known as CMC alloy, is a sandwich structured and flat-panel composite ...

[Last Updated : 2024-04-11]

High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange

MOLYBDENUM COPPER FLANGE FOR HERMETIC PACKAGES ELECTRONICS RF DEVICE PACKAGE FLANGE Description: Molybdenum Copper composite is similar with Tungsten-Copper composite, its thermal ...

[Last Updated : 2024-04-11]

High Thermal Conductivity Molybdenum Copper Flange For Rf Device Package Flange

CPC141 Carrier Heat Spreader Hermetic Packages Electronics No Magnetism

CPC141 Carrier / Heat Spreader / Flange For Hermetic Packages And Microelectronic Packages Description: CPC is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu ...

[Last Updated : 2024-04-11]

CPC141 Carrier Heat Spreader Hermetic Packages Electronics No Magnetism

Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount

Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount Description: W-Cu heat sink material is a composite of tungsten and copper, with both ...

[Last Updated : 2024-04-11]

Cu/MoCu/Cu Copper Heat Spreader , High Performance Copper Heat Sink

Hermetic Packages Electronics Material Cu/MoCu/Cu High-Performance Heat Sink Description: Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer ...

[Last Updated : 2024-04-11]

Cu/MoCu/Cu Copper Heat Spreader , High Performance Copper Heat Sink

S-CMC Carrier / Flange Hermetic Packages Electronics Material Good Processability

Hermetic Packages Electronics Material S-CMC Carrier / Flange / Heat Spreader Description: S-CMC is a multi-layered Copper and Molybdenum clad metal, which has an excellent ...

[Last Updated : 2024-04-11]

Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging

Copper Tungsten Composites Heat Dissipation Thermal Spreaders For Microelectronic Packaging Description: W-Cu heat sink material is a composite of tungsten and copper, with both ...

[Last Updated : 2024-04-11]

CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier

CPC Heat Sink / Carrier / Submount / Flange For RF And Microwave Amplifier / Transistor / TR Moudle Description: CPC is a sandwich composite similar to that of Cu/Mo/Cu including a ...

[Last Updated : 2024-04-11]

CPC Heat Sink Hermetic Packages Electronics For RF And Microwave Amplifier

Tungsten Copper CuW BTF Package Baseplate , CuMo Copper Molybdenum Heat Sink

Tungsten Copper CuW BTF Package Baseplate , CuMo Copper Molybdenum Heat Sink Description: CuW heat sink material is a composite of tungsten and copper, with both tungsten low ...

[Last Updated : 2024-04-11]

Tungsten Copper Heat Sink Hermetic Packages Electronics In Microelectronics

Tungsten Copper Heat Sink For Hermetic Packages Electronics In Microelectronics Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic ...

[Last Updated : 2024-04-11]

Tungsten Copper Heat Sink Hermetic Packages Electronics In Microelectronics

Mo80Cu20 Mo75C25 Hermetic Packages Electronics Heat Spreader With Nickel Plating

Mo80Cu20 Mo75C25 Mo70Cu30 Mo60Cu40 Mo50Cu50 Heat Spreader For Optoelectronics And Microwave Packages Description: Molybdenum copper alloy is a composite material of molybdenum and ...

[Last Updated : 2024-04-11]

Mo80Cu20 Mo75C25 Hermetic Packages Electronics Heat Spreader With Nickel Plating

Excellent Flatness Tungsten Copper Flange / Base For RF Package / Hermetic Package

Tungsten Copper Flange / Base For RF Package / Hermetic Package Description: CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion ...

[Last Updated : 2024-04-11]

Excellent Flatness Tungsten Copper Flange / Base For RF Package / Hermetic Package

Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers

Heat Dissipation Tungsten Copper Flange For Ceramic Packages In Optoelectronics Description: Tungsten copper heat sink is used for transferring heat generated in microelectronic ...

[Last Updated : 2024-04-11]

Low Porosity Hermetic Packages Electronics W60Cu40 W50Cu50 Flange For Optoelectronics Amplifiers

W75Cu25 Tungsten Copper Heat Sink Spreader ,Copper Molybdenum Heat Base With Nickel Plating

W75Cu25 Tungsten Copper Heat Sink Spreader ,Copper Molybdenum Heat Base With Nickel Plating Description: W-Cu heat sink material is a composite of tungsten and copper, with both ...

[Last Updated : 2024-04-11]

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