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Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors

Zhuzhou Jiabang Refractory Metal Co., Ltd
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Address: No.5 Building, No.581 Heilong Jiang Road, Li Yu Industrial Park, Tian Yuan District, Zhuzhou, Hunan, P.R. China.

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Zhuzhou Jiabang Refractory Metal Co., Ltd

Ultra Pure Low Density Heat Dissipating Mo / Cu Laminates In High Power Transistors

Country/Region china
City & Province zhuzhou hunan
Categories Copper Sheets
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Product Details

 

Ultra-pure Low Density Heat Dissipating Mo/cu Laminates In High-power Transistors

 

Description:

Consisting of ultra-pure molybdenum with OFC in 30% weight,molybdenum copper composite has the properties of higher thermal conductivity and lower density compared with pure molybdenum. Nowadays the electronic components is getting smaller and also requires greater power densities.

By using our moly copper carriers, you could receive efficent cooling effect and outstanding service life.

 

What we can offer:

1. With years of powder metalurgy experience, we can make very even grain size. And the material has no pores in inner structure.

This can ensure the material has good hermeticity. 

2. For different materials, we have ways of surface dealing to make sure the surface is good for your own plating.

3. We can offer all kinds of plating, including nickel plating, gold plating or Ag plating. If you wanna your carriers to be plated, you can let us know.

 

 

Product Properties:

GradeMo ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
70MoCu70±2%9.87200(25℃)/196(100℃)
60MoCu60±2%9.667.5222(25℃)/217(100℃)
50MoCu50±2%9.510.2250(25℃)/220(100℃)

 

 

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

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