Results forenepig bga package substratefrom 2466 Products.
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Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory ...
china
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BT Audio SoC BES2500YP-60 TWS Headset Main Control Chip BES2500 BGA Package Product Description BES2500YP-60 low-power BT audio SoC supports dual-mode BT 5.2, adaptive ANC active ...
china
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XC6SLX150-2FGG676I Programmable IC Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM ...
china
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3 / 4 OZ Rolled Copper Foil,Copper Foil Paper for IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 ...
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3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufactur...
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SMT Stencil Laser Cut 0.1mm Stainless Steel Shim for BGA Package 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.10mm stainless steel foil with ...
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BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build Technical Requirement for turnkey pcb assembly 1) Professional Surface-mounting and Through-hole ...
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New Original E1116AEBG-8E-F BGA Packaged Flash Memory PRODUCT DESCRIPTION Part number E1116AEBG-8E-F is manufactured by ELPIDA and distributed by Stjk. As one of the leading ...
china
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Electronic components Integrated Circuits (ICs) ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B ADI BGA IC Integrated Circuits Components Specification :ADV7842KBCZ-5P ADV8003KBCZ-8 ...
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Sensor IC Substrate Custom PCB With Components Circuit Board Maker Basic PCB information: Product Name: LGA IC Substrate PCB Material: Mitsubishi Gas halogen free BT HL832-NXA ...
china
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china
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Product profile 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.10mm stainless steel foil with aluminum frame 520 mm x 420 mm x 20mm dimension. It...
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Product Description: The Sapphire Substrate is available in both 2 inch and 4 inch sizes, making it suitable for a variety of uses. The substrate has a transparency range of 0.15 - ...
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Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, ...
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Cu/MoCu30/Cu CPC Copper Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging 1. Information Of Cu/MoCu30/Cu CPC 1:4:1 Substrate For Microelectronic ...
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New upgrade 0201 BGA mounting machine New upgrade mounting machine ETON newest smd smt mounting machine YT 202S is high speed and intelligent, ultra performance Machine application ...
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Polyethylene Packaging Film For Emulsion Explosive Packaging Product Description: It is a high-strength multi-layer composite film,It is made of HDPE as the base material, adding ...
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LFD2NX-40-8MG121C Lattice Certus-NX General Purpose FPGA on Nexus platform (28nm FD-SOI) BGA-121 Manufacturer: Lattice Series: LFD2NX-40 Number of logic elements: 39000 LE Embedded ...
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High quality 0.5W Germicidal UVC LED 255nm Deep UV LEDs for uv led box Priduct application Quartz glass package High radiant flux Narrow Wavelength Inorganic & Nitrogen package Low ...
china
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid ...
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