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[China]
Trade Verify
Address: West of 2nd Floor, Building 10, Zhengzhong Science Park, Xintian Community, Fuhai Street, Bao'an District, Shenzhen China 518103
Contact name:Yoyo
Shenzhen Huafu Fast Multilayer Circuit Co. LTD |
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Verified Suppliers
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Specifications
| Item | Requirement | Result | ACC | REJ | |
| Laminate | Type | FR-1 | FR-1 | √ | |
| Supplier | KB | KB | √ | ||
| Board thickness | 1.60±10% mm | 1.61-1.65 mm | √ | ||
| Outer copper foil | >=35 ｕm | 44.17 | √ | ||
| Inner copper foil | / | / | √ | ||
| Warp-twist | <= 0.75% | 0.68% | √ | ||
| legend | Type | KUANG SHUN | KUANG SHUN | √ | |
| Color | Black | Black | √ | ||
| Location | CS | CS | √ | ||
| Marking | Co.logo | / | / | √ | |
| UL.logo | / | / | √ | ||
| Date code | / | / | √ | ||
| Marking form | / | / | √ | ||
| Location | / | / | √ | ||
| Min line width (mil) | 7.874 | 8.1 | √ | ||
| Min line spacing (mil) | 6.5 | 6.3 | √ | ||
| Min ring width (mil) | NA | NA | / | ||
| Solder Mask | Type | / | / | √ | |
| Color | / | / | √ | ||
| Thickness | / | / | √ | ||
| Pencil Test | / | / | √ | ||
| SOLVENT TEST | / | / | √ | ||
| TAPE TEST | / | / | √ | ||
| Surface treament | Lead free HASL | OK | √ | ||
| Special Treament | Silk screen | / | / | √ | |
| Location | / | / | √ | ||
| Forming | V-cut | OK | √ | ||
| Normal Testing | Electrical test | 100% PCB passed | OK | √ | |
| Visual inspection | IPC-A-600H&IPC-6012B | OK | √ | ||
| Solderability Test | 245℃ 5S 1 Cycle | OK | √ | ||
| Final inspection report | ||||||||
| Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm) | ||||||||
| NO | Required | PTH | Actual dimension | ACC | REJ | |||
| 1 | 2.050±0.05 | N | 2.050 | 2.025 | 2.075 | 2.050 | √ | |
| 2 | 3.000±0.05 | N | 3.000 | 2.975 | 3.025 | 3.000 | √ | |
| V-CUT Finish dimension (unit: mm): including | ||||||||
| NO | Required Dimension (tolerance) | Actual dimensin | ACC | REJ | ||||
| 1 | 260.99±0.15 | 261.01 | 260.89 | 261.07 | 261.10 | √ | ||
| 2 | 230.00±0.15 | 229.88 | 229.94 | 230.05 | 230.09 | √ | ||
| Reference engineering information | ||||||||
| Hole drill drawing | ACC | |||||||
| Conductor and film | ACC | |||||||
| Solder mask and film | ACC | |||||||
| Legend and film | ACC | |||||||
| Engineering changing | ACC | |||||||
| E-test Report | |||||||
| Test Type | General | Test Parameter | |||||
| Special | Test Votage | 250V | |||||
| Single mould | Test Curent | 100 m A | |||||
| Double mould | √ | Conducting Resistance | 20 M ohm | ||||
| Flying probe Test | √ | Isolated Resistance | 20 M ohm | ||||
| Test Points | 160 | All Open Test | Qualified | √ | |||
| Failure | |||||||
| The first pass Qty | 358 | All short Test | Qualified | √ | |||
| Failure | |||||||
| Reject Qty | 2 pcs | The first pass Rate | 99% | ||||
| Mian Dwfect Desciption: | |||||||
| 1 | Open Qty | 0 PCS | Repaired Qty | 0 PCS | Scrap | 0 PCS | |
| 2 | Short Qty | 0 PCS | Repaired Qty | 0 PCS | Scrap | 0 PCS | |
| 3 | Con. Defect | 0 PCS | Repaired Qty | 0 PCS | Scrap | 0 PCS | |
| 4 | Isolated Defect | 0 PCS | Repaired Qty | 0 PCS | Scrap | 0 PCS | |
| 5 | Others | 2 PCS | Repaired Qty | 0 PCS | Scrap | 2 PCS | |
| Remark: | |||||||
| Microsection Analysis Report | |||||||||||
| purpose & Req | Hole wall | Trace | |||||||||
| Copper | ≧ | 20 um | Surface copper | 35 um | |||||||
| Nickel | ≧ | 0 um | Base copper | 11 um | |||||||
| Au | ≧ | 0 um | V/X | ||||||||
| Tin/Lead | ≧ | 3.92 um | |||||||||
| Roughness | ≦ | 25 um | |||||||||
| Hole wall position Unit: ｕm | A | B | C | D | E | F | Average | Roughness | Speciment Location | ||
| Drill | Plated | ||||||||||
| 1 | 25.600 | 24.400 | 24.460 | 26.100 | 25.380 | 25.010 | 25.158 | 21.529 | 21.629 | ||
| 2 | 24.221 | 23.021 | 23.081 | 24.721 | 24.001 | 23.631 | 23.779 | 19.327 | 19.427 | ||
| 3 | 25.513 | 24.313 | 24.373 | 23.013 | 25.293 | 24.923 | 25.071 | 17.290 | 17.390 | ||
| Trace Copper | Base Copper | Solder mask thickness | T/L THK | Ni THK | Au THK | Speciment Location | |||||
| 1 | 44.90 | 12.95 | 13.60 | 5.25 | |||||||
| 2 | 44.94 | 12.81 | 12.08 | 8.25 | |||||||
| 3 | 42.66 | 10.52 | 15.23 | 6.25 | |||||||
| Defects Inspection | |||||||||||
| Found | NO Found | ||||||||||
| 1.Plating crack | √ | ||||||||||
| 2.Resion recession | √ | ||||||||||
| 3.Plating void | √ | ||||||||||
| 4.Delamination | √ | ||||||||||
| 5.Smear | √ | ||||||||||
| 6.Copper crack | √ | ||||||||||
| 7.Blistering | √ | ||||||||||
| 8.Interconnection separation | √ | ||||||||||
| 9.Laminate void | √ | ||||||||||
| 10.wicking | √ | ||||||||||
| 11.Nail Heading | √ | ||||||||||
| Reliability Test Report | |||||||||||
| NO. | Item | Requirement | Test freqency | Test result | |||||||
| 1 | Solderability test | 245±5℃ 5sec wetting area least 95% | 1 | ACC | |||||||
| 2 | Thermal Stress | 288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall | 1 | ACC | |||||||
