Active Member
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[China]
Address: JN1226, TREND CENTRE, 29-31 CHEUNG LEE STREET, CHAI WAN, HONG KONG
Contact name:Hidar
HIDAR NEW MATERIAL GROUP LIMITED |
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PA adhesive, Low pressure molding Adhesive, adhesive used in PCB / wire / betteries industry, Polyamide hotmelt adhesive, quality same as Henkel
Low pressure molding is a gentle injection molding process utilizing polyamide hot melt adhesives and is designed as a viable solution for encapsulation and sealing of printed circuit boards (PCBs), batteries and connectors, and provides effective strain relief for wire harnesses and cables.
Due to the low pressure during the injection process, electrical components will keep functioning and even thin wires will not be released from their contact pins. The hot melt is mainly based on natural raw materials, the cost for the molds are very low due to the low pressure and the fact that the hot melt is neither abrasive, nor corrosive.
20kg/bag, 25bags/pallet
Around 10 days after payment
Q: Are you manufacturer or trader?
A: We're manufacturer, offering high quality and wonderful service
Q: Do you have any certificates?
A: Yes, our product has RoHS, UL
Q: What's the exact usage of Low pressure injection molding adhesive?
A: Low Pressure Injection Molding Compound Applications:
• Fiber optics
• Cable transitions
• Wire harnesses
• Sensors
• Connectors
• Grommets
• Switches
• Batteries
We specialize in manufacturing and exporting kinds of chemicals, such as:
PA hot melt adhesive ( Low pressure molding adhesive),
Aniline,
Dimethyl formamide,
Dimethyl carbonate,
Propylene glycol,
Dichloropropane,
Methylene chloride,
Refind naphthalene,
Maleic anhydride, etc.,
which are very competitive and highly respected by our customers.
Please kindly note we welcome your further request for more infomation.
It's our sincere wish to work together with each other in the near future.
Let's talk more!
skype: rachel.chem.cn
Email: hdev@weathrachel.com
rachelhdev@hotmail.com
