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HIDAR NEW MATERIAL GROUP LIMITED
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[China] country

Address: JN1226, TREND CENTRE, 29-31 CHEUNG LEE STREET, CHAI WAN, HONG KONG

Contact name:Hidar

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HIDAR NEW MATERIAL GROUP LIMITED

Featured Products: Foaming agent, industrial Dichloromethane, brands solvent, queen of Methylene chloride, Methylene chloride, PU Foaming agent, Dichloromethane, Methylene chloride supplier, Low pressure molding Adhesive / PA hot melt adhesive and more.
Product Description Foaming agent, EINECS: 200-838-9, industrial Dichloromethane, brands solvent, queen of Methylene dichloride Colorless and transparent, without suspended matter. ...
[Last Updated : 2024-04-15]
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Product Description Methylene chloride, PU Foaming agent, Dichloromethane, Methylene chloride supplier EINECS: 200-838-9 Colorless and transparent, without suspended matter. It's ...
[Last Updated : 2024-04-15]
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Low pressure molding Adhesive, adhesive for PCB Product Description Low pressure molding is a gentle injection molding process utilizing polyamide hot melt adhesives and is ...
[Last Updated : 2024-04-15]
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PA hotmelt adhesive, Low pressure molding Adhesive, adhesive for PCB, wire, betteries Product Description Low pressure molding is a gentle injection molding process utilizing ...
[Last Updated : 2024-04-15]
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PA hotmelt adhesive, Low pressure molding Adhesive, adhesive used in PCB, wire, betteries industry, Polyamide adhesive Product Description Low pressure molding is a gentle ...
[Last Updated : 2024-04-15]
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Adhesive, Low pressure molding Adhesive, PA hotmelt adhesive used in PCB, wire, bettery industry Product Description Low pressure molding is a gentle injection molding process ...
[Last Updated : 2024-04-15]
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Adhesive, PA hotmelt adhesive for Printed Circuit Board, Betteries. Low pressure molding Adhesive Product Description Low pressure molding is a gentle injection molding process ...
[Last Updated : 2024-04-15]
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PA adhesive, Low pressure molding Adhesive, adhesive used in PCB / wire / betteries industry, Polyamide hotmelt adhesive, quality same as Henkel Product Description Low pressure ...
[Last Updated : 2024-04-15]
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DMF / N, N-Dimethyl Formamide of the best, with lowest price, UN NO.: 2265, CAS NO.: 68-12-2 1) Standard: GB4117-92 2) Molecular formula: C3H7NO 3) Purity: 99.95% 4) Moisture: 1000...
[Last Updated : 2024-04-15]
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Pigment industry, raw material, CAS No.: 68-12-2, best of DMF/ Dimethyl Formamide, 68-12-2 1) Standard: GB4117-92 2) Molecular formula: C3H7NO 3) Purity: 99.95% 4) Moisture: 1000...
[Last Updated : 2024-04-15]
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Product Description Industrial grade PG, Resin-material, PTT industry, supplier of Propylene Glycol / MonoPG / MPG Description Propylene Glycol is a water-white sticky-thick ...
[Last Updated : 2024-04-15]
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Product Description Industrial grade PG, Resin-material, PTT industry, supplier of Propylene Glycol / MonoPG / MPG Description Propylene Glycol is a water-white sticky-thick ...
[Last Updated : 2024-04-15]
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Product Description Epoxy resin material, plasticizer industry, suface active agent, CAS NO.: 57-55-6, MPG Description Propylene Glycol is a water-white sticky-thick hydrophilic ...
[Last Updated : 2024-04-15]
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Phenylamine, Aniline, CAS No.: 62-53-3, UN No.:1547, Aniline oil supplier EINECS NO.: 200-539-3 Synonyms: Aminobenzene; phenylamine, Aminophen; Anyvim; Kyanol; Blue Oil; Phenylamin...
[Last Updated : 2024-04-15]
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PA adhesive, Low pressure molding Adhesive, adhesive used in PCB / wire / betteries industry, Polyamide hotmelt adhesive, quality same as Henkel Product Description Low pressure ...
[Last Updated : 2024-04-15]
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Car adhesive, Battery adhesive, PA adhesive, Low pressure molding Adhesive, adhesive used in PCB / wire industry, Polyamide hotmelt adhesive, quality same as Henkel Product ...
[Last Updated : 2024-04-15]
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Car adhesive, Battery adhesive, PA adhesive, Low pressure molding Adhesive, adhesive used in PCB / wire industry, Polyamide hotmelt adhesive, quality same as Henkel Product ...
[Last Updated : 2024-04-15]
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Sealing of Connectors, Car adhesive, Battery adhesive, PA adhesive, Low pressure molding Adhesive, adhesive used in PCB / wire industry, Polyamide hotmelt adhesive, quality same as ...
[Last Updated : 2024-04-15]
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Encapsulation and Sealing of Connectors/PCB/Battery, Car adhesive, PA adhesive, Low pressure molding Adhesive, adhesive used in wire industry, Polyamide hotmelt adhesive, quality ...
[Last Updated : 2024-04-15]
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Strain relief for wire harnesses and cables, strong adhesive, Encapsulation and Sealing of Connectors/PCB/Battery, Car adhesive, PA adhesive, Low pressure molding Adhesive, ...
[Last Updated : 2024-04-15]
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