PCB Adhesive, Injection / LPMS201, strong same as Henkel, Low pressure molding adhesive

 Low pressure molding is a gentle injection molding process utilizing polyamide hot melt adhesives and is designed as a viable solution for encapsulation and sealing of printed circuit boards (PCBs), batteries and connectors, and provides effective strain relief for wire harnesses and cables.

 Due to the low pressure during the injection process, electrical components will keep functioning and even thin wires will not be released from their contact pins. The hot melt is mainly based on natural raw materials, the cost for the molds are very low due to the low pressure and the fact that the hot melt is neither abrasive, nor corrosive.

20kg/bag, 25bags/pallet

Around 10 days after payment 

Q: Are you manufacturer or trader?

A: We're manufacturer, offering high quality and wonderful service

Q: Do you have any certificates?

A: Yes, our product has RoHS, UL

Q: What's the exact usage of Low pressure injection molding adhesive?

A: Low Pressure Injection Molding Compound Applications:

• Fiber optics

• Cable transitions

• Wire harnesses

• Sensors

• Connectors

• Grommets

• Switches

• Batteries