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Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Shenzhen Aochuan Technology Co., Ltd
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Address: 302 GuihuaRoad, GuixiangVillage, GuanlanTown, LonghuaDistrict, Shenzhen City,Guangdong Province, P.R China

Contact name:Jason Zhan

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Shenzhen Aochuan Technology Co., Ltd

Anti Seismic Thin Thermal Pad Material Anticorrosive For Telecom Device

Country/Region china
City & Province shenzhen guangdong
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Product Details

Pink Silicone Low Oil Permeability Thermal Pad Material For Telecom Device

 

AttributeValueTest Method
CompositionCeramic Filler + Silicone-
ColorPinkVisual
Thickness(mm)0.5~10astm d374
Density(g/cc)3.35ASTM D792
Hardness(shore oo)55±10ASTM D2240
Usage Temperature(℃)-40~150--
Electrical  
Breakdown Voltage(kv/mm)>6.0ASTM D149
Dielectric Constant(@10mhz)7.2ASTM D150
Volume Resistivity(Ω.cm)1012ASTM D257
FlammabilityV-0UL94
Thermal  
Thermal conductivity(W/m.K)8.0±0.5ASTM D5470


Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

 

AttributeValueTest Method
CompositionCeramic Filler + Silicone-
ColorPinkVisual
Thickness(mm)0.5~10astm d374
Density(g/cc)3.35ASTM D792
Hardness(shore oo)55±10ASTM D2240
Usage Temperature(℃)-40~150--
Electrical  
Breakdown Voltage(kv/mm)>6.0ASTM D149
Dielectric Constant(@10mhz)7.2ASTM D150
Volume Resistivity(Ω.cm)1012ASTM D257
FlammabilityV-0UL94
Thermal  
Thermal conductivity(W/m.K)8.0±0.5ASTM D5470
 

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