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Notebook Thermal Pad

Shenzhen Aochuan Technology Co., Ltd
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Address: 302 GuihuaRoad, GuixiangVillage, GuanlanTown, LonghuaDistrict, Shenzhen City,Guangdong Province, P.R China

Contact name:Jason Zhan

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Shenzhen Aochuan Technology Co., Ltd

Notebook Thermal Pad

Country/Region china
City & Province shenzhen guangdong
Categories Other Computer Accessories
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Product Details

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.k thermal conductivity

AttributeValueTest Method
CompositionCeramic Filler, Silicone, and Reinforced Fiberglass-
ColorWhite and Brick RedVisual
Thickness(mm)0.5~12.0ASTM D374
Density(g/cc)2.5ASTM D792
Hardness(shore oo)30±5ASTM D2240
Tensile Strength(KN/m)2.5ASTM D624
Elongation(%)60ASTM D412
Usage Temperature(℃)-40~150--
Electrical  
Breakdown Voltage(kv/mm)≥7.0ASTM D149
Dielectric Constant(@10mhz)5.7ASTM D150
Volume Resistivity(Ω.cm)1.0*1013ASTM D257
FlammabilityV-0UL94
Thermal  
Thermal conductivity(W/m.K)1.0±0.1ASTM D5470

 

Product feature:
■ Thermal Conductivity:1.0 W/m.K
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ 
thermal silicone sheet with shock absorption and sound absorption effect;
■ High breakdown voltage
■ 
The main purpose of the thermal conductive silica gel piece is to reduce the thermal resistance generated between the heat source surface and the contact surface of the heat dissipation device. The thermal conductive silica gel piece can fill the gap of the contact surface well.
■ Elongation 60%

 

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

 

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

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