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ul enig ic package substrate

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Results forul enig ic package substratefrom 51242 Products.
semiconductor FCCSP Package Substrate manufacture

semiconductor FCCSP Package Substrate manufacture

Apr,11,2024
Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
Control Board 2 Layers FR4 2OZ TG170 UL ENIG 2U PCB Prototype Board manufacturer

Control Board 2 Layers FR4 2OZ TG170 UL ENIG 2U" PCB Prototype Board manufacturer

Apr,11,2024
Control Board 2 Layers FR4 2OZ TG170 UL ENIG 2U" PCB Prototype Board manufacturer Detail Specifications: Layers2 Layers Material FR-4 Board Thickness 1.6mm Copper Thickness 2oz ...
Guangdong, china
Shenzhen KAZ Circuit Co., Ltd
Verified
FCCSP package substrate 4L Buildup types ENEPIG

FCCSP package substrate 4L Buildup types ENEPIG

Apr,11,2024
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
FR4 2OZ TG170 UL ENIG 2U PCB Printed Circuit Board 2 Layers

FR4 2OZ TG170 UL ENIG 2U" PCB Printed Circuit Board 2 Layers

Apr,11,2024
Control Board 2 Layers FR4 2OZ TG170 UL ENIG 2U" PCB Prototype Board manufacturer Detail Specifications: Layers2 Layers Material FR-4 Board Thickness 1.6mm Copper Thickness 2oz ...
Guangdong, china
Shenzhen KAZ Circuit Co., Ltd
Verified
0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

Apr,11,2024
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
Control Board 2 Layers FR4 2OZ TG170 UL ENIG 2U PCB Prototype Board

Control Board 2 Layers FR4 2OZ TG170 UL ENIG 2U" PCB Prototype Board

Apr,11,2024
Control Board 2 Layers FR4 2OZ TG170 UL ENIG 2U" PCB Prototype Board manufacturer Detail Specifications: Layers2 Layers Material FR-4 Board Thickness 1.6mm Copper Thickness 2oz ...
Guangdong, china
Shenzhen KAZ Circuit Co., Ltd
Verified
2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

Apr,11,2024
Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronic...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
Control Board 4 Layers PCB FR4 3OZ TG170 UL ENIG 2U PCB Prototype Board Manufacturer

Control Board 4 Layers PCB FR4 3OZ TG170 UL ENIG 2U" PCB Prototype Board Manufacturer

Apr,11,2024
Control Board 2 Layers FR4 2OZ TG170 UL ENIG 2U" PCB Prototype Board manufacturer Detail Specifications: Layers2 Layers Material FR-4 Board Thickness 1.6mm Copper Thickness 2oz ...
Guangdong, china
Shenzhen KAZ Circuit Co., Ltd
Verified
MCP package Substrate 0.5oz Copper Customize BT Material

MCP package Substrate 0.5oz Copper Customize BT Material

Apr,11,2024
MCP Substrate Manufacture Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; HOREXS-Hubei is belong to HOREXS Group, is ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
Custom Control Board 4 Layers PCB FR4 TG170 UL ENIG 2U PCB Prototype Board Manufacturer

Custom Control Board 4 Layers PCB FR4 TG170 UL ENIG 2U" PCB Prototype Board Manufacturer

Apr,11,2024
Control Board 2 Layers FR4 2OZ TG170 UL ENIG 2U" PCB Prototype Board manufacturer Detail Specifications: Layers2 Layers Material FR-4 Board Thickness 1.6mm Copper Thickness 2oz ...
Guangdong, china
Shenzhen KAZ Circuit Co., Ltd
Verified
Flash/NAND memory package substrate production

Flash/NAND memory package substrate production

Apr,11,2024
Application:Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
Multilayer BT materials semiconductor package substrate manufacture

Multilayer BT materials semiconductor package substrate manufacture

Apr,11,2024
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
FBGA Package substrate production supporting BT 40um core

FBGA Package substrate production supporting BT 40um core

Apr,11,2024
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,FC package substrate,FlipChip substrate,Flipchip BGA substrate;IC package,Semiconductor ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
CMOS sensors ic package manufacture supporting

CMOS sensors ic package manufacture supporting

Apr,11,2024
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,telecommunication electronics,consumer electronics,Storage IC substrage;IC package,Semiconductor ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
BT material BGA semiconductor package Substrate production

BT material BGA semiconductor package Substrate production

Apr,11,2024
All types BGA of memory substrate manufacture China Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Short introduction ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
semiconductor packaging Substrate of DRAM Memory manufacture

semiconductor packaging Substrate of DRAM Memory manufacture

Apr,11,2024
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System

Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System

Apr,11,2024
stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with different functions to provide multi...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
RF/Wireless/5G IC module substrate manufacture

RF/Wireless/5G IC module substrate manufacture

Apr,11,2024
Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

Apr,11,2024
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; ...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
microelectronics package substrate manufacture

microelectronics package substrate manufacture

Apr,11,2024
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of substrate production: Mini.Line space...
china
HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified
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