Results forbt sip package substratefrom 2010 Products.
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stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with different functions to provide multi...
china
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Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time *, *::before, *::after {box-sizing: border-box;}* {margin: 0;}html, body {height: 100%;}body {line...
china
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GS600SU Underfill Dispensing Machine for Die Form Underfi ll GS600 SU is a high- speed and high- precision automatic online dispensing system which is developed based on Underfill ...
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BT IC BGM123N256V2 Blue Gecko BT SiP Module 2dBm Wireless BT 4.2 LE Modules [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + ...
china
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3 / 4 OZ Rolled Copper Foil,Copper Foil Paper for IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 ...
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Custom logo Printed apparel clothing garment bt shirt packaging boxes for t-shirt Tshirt packaging box have been a huge hit in e-commerce and kit retail sales. Shown here are a ...
china
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Product Description: Passive IC Components are essential components used in electrical and electronic circuits, with a wide range of applications such as industrial, automotive, ...
china
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SLA5013 Mosfet Power Module Electrnic IC Chips Integrated Circuit IC Components N-channel + P-channel H-bridge A part of stock list C.I MM74HC164MX FSC P0552AD/P9FAD SOP-14 DIODO ...
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Overview : DHT11 digital temperature and humidity sensor is a calibrated digital signal output temperature and humidity Composite sensor. It uses a dedicated number Word module ...
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PLC Control Automatic CIP And SIP Aseptic Filling Line for Pharmaceutical Industry Product Description: Tox Box Aseptic Filling Machine is a professional equipment for packaging ...
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Cu/MoCu30/Cu CPC Copper Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging 1. Information Of Cu/MoCu30/Cu CPC 1:4:1 Substrate For Microelectronic ...
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Polyethylene Packaging Film For Emulsion Explosive Packaging Product Description: It is a high-strength multi-layer composite film,It is made of HDPE as the base material, adding ...
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High quality 0.5W Germicidal UVC LED 255nm Deep UV LEDs for uv led box Priduct application Quartz glass package High radiant flux Narrow Wavelength Inorganic & Nitrogen package Low ...
china
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid ...
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Serial RS-232C USB2.0 Interface Sokkia FX-201 FX-202 total station with BT Class 1 ts : Packaging & Shipping Our Services 1. Warranty: 12 months warranty is offered for survey ...
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High Gloss Clear BOPP Film Heat Sealable For Food Packaging Description: BOPP (Biaxially Oriented PolyPropylene) films are widely used in various applications, including packaging, ...
china
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Automatic High Speed Waterproof Coating Machine for Paper Cup Packaging Material Product Parameters Technical Parameters Specification FM-T1020 Max.Web Width 1020mm Max.Diameter ...
china
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Product Description: Milk Tea Bottles Welcome to the world of Milk Tea Bottles! Our bottles are specially designed for all bubble tea lovers out there. With its lightweight and ...
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UV Ink Capable Thermal Positive Aluminum Plate CTP Plate 1. Application EcooGraphix Thermal Solvent Resistance CTP plate can be used for long runs high grade commercial and ...
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Flexiblbe Packaging Label Sticker Making Hot Melt Pressure Industrial Adhesive Description : hot melt pressure sensitive Adhesive glue used for tyre labels It is a synthetic rubber ...
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