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10mil TC350 Double Sided Rogers PCB Board For Microwave Combiners

Bicheng Electronics Technology Co., Ltd

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10mil TC350 Double Sided Rogers PCB Board For Microwave Combiners

Country/Region china
City & Province shenzhen guangdong
Categories Other Rubber Products
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Product Details

 

Double Sided PCB Built On 10mil Rogers TC350 With Immersion Gold for Microwave Combiners.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Rogers' TC350 is a woven fiberglass reinforced, ceramic filled, PTFE based composite for use as making printed circuit board.TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

 

Features & Benefits:

1. The increased thermal conductivity of TC350 provides higher power handling, reduces hot-spots and improves device reliability. This results in reduced junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs.

 

2. TC350 has excellent Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes.

 

3. TC350 enjoys a strong bond to copper, utilizing microwave grade, low profile copper. This results in even lower insertion loss due to skin effect losses of copper that are more obvious at higher RF and microwave frequencies.

 

Our PCB Capabilities (TC350)

PCB Material:Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite
Designation:TC350
Dielectric constant:3.5±0.05
Thermal Conductivity0.72 W/m-K
Dissipation FactorDf .002@10 GHz
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Typical Applications:

1. Microwave Combiner and Power Dividers

2. Power Amplifiers, Filters and Couplers

3. Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)

4. Thermally Cycled Antennas sensitive to dielectric drift

 

 

Typical Properties of TC350:

PropertyUnitsValueTest Merthod
1. Electrical Properties 
Dielectric Constant (may vary by thickness)   
@1 MHz3.50IPC TM-650 2.5.5.3
@1.8 GHz3.50RESONANT CAVITY
@10 GHz3.50IPC TM-650 2.5.5.5
Dissipation Factor   
@1 MHz0.0015IPC TM-650 2.5.5.3
@1.8 GHz0.0018RESONANT CAVITY
@10 GHz0.0020IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric  
TC r @ 10 GHz (-40-150°C)ppm/ºC-9IPC TM-650 2.5.5.5
Volume Resistivity   
C96/35/90MΩ-cm7.4x106IPC TM-650 2.5.17.1
E24/125MΩ-cm1.4x108 
Surface Resistivity   
C96/35/903.2x107IPC TM-650 2.5.17.1
E24/1254.3x108IPC TM-650 2.5.17.1
Electrical StrengthVolts/mil (kV/mm)780 (31)IPC TM-650 2.5.6.2
Dielectric BreakdownkV40IPC TM-650 2.5.6
Arc Resistancesec>240IPC TM-650 2.5.1
2.Thermal Properties 
Decomposition Temperature (Td)   
Initial°C520IPC TM-650 2.4.24.6
5%°C567IPC TM-650 2.4.24.6
T260min>60IPC TM-650 2.4.24.1
T288min>60IPC TM-650 2.4.24.1
T300min>60IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºCppm/ºC7, 7IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºCppm/ºC12IPC TM-650 2.4.24
% z-axis Expansion (50-260ºC)%1.2IPC TM-650 2.4.24
3. Mechanical Properties 
Peel Strength to Copper (1 oz/35 micron)   
After Thermal Stresslb/in (N/mm)7 (1.2)IPC TM-650 2.4.8
At Elevated Temperatures (150ºC)lb/in (N/mm)9 (1.6)IPC TM-650 2.4.8.2
After Process Solutionslb/in (N/mm)7 (1.2)IPC TM-650 2.4.8
Young’s Moduluskpsi (MPa) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross)kpsi (MPa)14/10 (97/69)IPC TM-650 2.4.4
Tensile Strength (Machine/Cross)kpsi (MPa)11/8 (76/55)IPC TM-650 2.4.18.3
Compressive Moduluskpsi (MPa) ASTM D-3410
Poisson’s Ratio ASTM D-3039
4. Physical Properties 
Water Absorption%0.05IPC TM-650 2.6.2.1
Density, ambient 23ºCg/cm32.30ASTM D792 Method A
Thermal ConductivityW/mK0.72ASTM D5470
Specific HeatJ/gK0.90ASTM D5470
FlammabilityclassV0UL-94
NASA Outgassing, 125ºC, ≤10- 6 torr   
Total Mass Loss%0.02NASA SP-R-0022A
Collected Volatiles%0.01NASA SP-R-0022A
Water Vapor Recovered%0.01NASA SP-R-0022A

 

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