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Double Layer Rogers PCB Built on 32.7mil RO4003C LoPro Reverse Treated Foil for Cellular Base Station Antennas
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.
Features and Benefits:
RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density
Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility
Lead-free process compatible
1. High temperature processing
2. Meets environmental concerns
CAF resistant
lOur PCB Capability (RO4003C LoPro)
| PCB Material: | Hydrocarbon Ceramic Laminates |
| Designation: | RO4003C LoPro |
| Dielectric constant: | 3.38±0.05 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Some Typical Applications:
1. Digital applications such as servers, routers, and high speed back planes
2. Cellular base station antennas and power amplifiers
3. LNB’s for direct broadcast satellites
4. RF Identification Tags
Typical Properties of RO4003C LoPro
| Property | Typical Value | Direction | Units | Condition | Test Method |
| Dielectric Constant, Process | 3.38 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant, Design | 3.5 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factor tan, | 0.0027 0.0021 | z | -- | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coeffifi cient of r | 40 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 X 1010 | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 X 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | z | KV/mm(V/mil) | 0.51mm(0.020”) | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 26889(3900) | Y | MPa(kpsi) | RT | ASTM D638 |
| Tensile Strength | 141(20.4) | Y | MPa(kpsi) | RT | ASTM D638 |
| Flexural Strength | 276(40) | MPa(kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m(mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
| Coeffifi cient of Thermal Expansion | 11 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| 14 | y | ||||
| 46 | z | ||||
| Tg | >280 | °C TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | °C TGA | ASTM D3850 | ||
| Thermal Conductivity | 0.64 | W/m/°K | 80°C | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 | |
| Density | 1.79 | gm/cm3 | 23°C | ASTM D792 | |
| Copper Peel Strength | 1.05(6.0) | N/mm(pli) | after solder float 1 oz. TC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-Free Process Compatible | Yes |
