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[China]
Trade Verify
Address: 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact name:Ivy Deng
Bicheng Electronics Technology Co., Ltd |
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Verified Suppliers
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Introducing our Hybrid PCB: a cutting-edge solution that combines the benefits of Tg170 FR-4 and 20mil RO4003C materials to deliver exceptional performance and versatility. This hybrid design allows for the integration of different functionalities, making it ideal for a wide range of applications.
Features:
Mixed-Signal Compatibility:
Our Hybrid PCB supports both analog and digital signals, thanks to
the combination of Tg170 FR-4 and 20mil RO4003C materials. The FR-4
portion ensures reliable performance for standard circuitry, while
the RO4003C portion provides excellent high-frequency
characteristics for RF/microwave signals.
High-Frequency Performance:
The RO4003C material excels in high-frequency applications with its
low dielectric loss and superior signal integrity. This results in
efficient signal transmission, minimal loss, and reduced signal
distortion, making it ideal for demanding RF/microwave
applications.
Thermal Management:
The inclusion of FR-4 in our Hybrid PCB enhances thermal
conductivity, enabling effective heat dissipation from components.
This feature is particularly valuable for applications that require
efficient thermal management to maintain optimal performance.
Design Flexibility:
Our Hybrid PCB offers unparalleled design flexibility, allowing for
the integration of different technologies and materials. Designers
can strategically optimize the layout and material selection for
each section of the board, tailoring it precisely to the
requirements of specific functionalities.
Cost Optimization:
By selectively incorporating RO4003C where high-frequency
performance is required, our Hybrid PCB optimizes costs. The
utilization of FR-4 for other sections provides a cost-effective
solution without compromising performance, making it an economical
choice compared to using high-frequency materials throughout the
entire board.
Compatibility:
Both Tg170 FR-4 and RO4003C are fully compatible with standard PCB
fabrication processes, ensuring seamless manufacturing and
assembly. This compatibility simplifies the integration of our
Hybrid PCB into existing production workflows.
PCB Stackup:
Our Hybrid PCB features a 6-layer rigid construction with the
following stackup:
Copper Layer 1: 35 μm
RO4003C: 0.508 mm (20mil)
Copper Layer 2: 35 μm
Prepreg: 0.102 mm
Copper Layer 3: 35 μm
Tg170°C FR-4: 0.254 mm
Copper Layer 4: 35 μm
Prepreg: 0.102 mm
Copper Layer 5: 35 μm
Tg170°C FR-4: 0.508 mm
Copper Layer 6: 35 μm
PCB Construction Details:
Board Dimensions: 356mm x 373mm (+/- 0.15mm) in 3 types, totaling 3
pieces
Minimum Trace/Space: 4/4 mils, ensuring precise circuit design and
layout
Minimum Hole Size: 0.35mm, supporting fine-pitch components and
high-density interconnects
No Blind Vias: Simplicity in design and manufacturing process
Finished Board Thickness: 1.8mm, providing durability and
structural integrity
Finished Copper Weight: 1oz (1.4 mils) on outer layers,
guaranteeing optimal conductivity
Via Plating Thickness: 20 μm, ensuring reliable electrical
connections
Surface Finish: HASL, providing excellent solderability and
protection against oxidation
Top Silkscreen: White, facilitating component placement and
identification
Bottom Silkscreen: Not applicable
Top Solder Mask: Blue, safeguarding copper traces and preventing
solder bridges
Bottom Solder Mask: Blue, protecting copper traces on the bottom
layer
100% Electrical Test: Each PCB undergoes a comprehensive electrical
test before shipping, ensuring functionality and quality.
| RO4003C Typical Value | |||||
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
| Dielectric Constant,εDesign | 3.55 | Z | 8 to 40 GHz | Differential Phase Length Method | |
| Dissipation Factortan,δ | 0.0027 0.0021 | Z | 10 GHz/23℃ 2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
| Surface Resistivity | 4.2 x 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850) 19,450(2,821) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2) 100(14.5) | X Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276 (40) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
| Dimensional Stability | <0.3 | X,Y | mm/m (mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11 14 46 | X Y Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
| Td | 425 | ℃ TGA | ASTM D 3850 | ||
| Thermal Conductivity | 0.71 | W/M/oK | 80℃ | ASTM C518 | |
| Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ | ASTM D 570 | |
| Density | 1.79 | gm/cm3 | 23℃ | ASTM D 792 | |
| Copper Peel Stength | 1.05 (6.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
| Flammability | N/A | UL 94 | |||
| Lead-free Process Compatible | Yes | ||||
PCB Statistics:
The Hybrid PCB incorporates a total of 127 components and features 413 pads for component connections. Out of these pads, 216 are dedicated to thru-hole components, while the remaining 197 pads are for surface mount technology (SMT) components on the top layer. There are no SMT pads on the bottom layer. The PCB includes 175 vias to establish connections between different layers. A total of 12 nets represent the interconnected paths between components, ensuring proper signal flow and functionality.
Artwork Supplied: Gerber RS-274-X
Quality Standard: Our Hybrid PCB adheres to IPC-Class-2 quality standards, ensuring high reliability and performance.
Availability: Our Hybrid PCB is available worldwide and can cater to diverse industries and applications.
Typical Applications:
- Telecommunications
- Radar systems, satellite communications, avionics
- Vehicle communication modules
- Patient monitoring systems
- Industrial automation systems
- Spectrum analyzers, network analyzers, and signal generators
