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Sharing a new RF PCB made of TU-768 material. The TU-768 laminate by Taiwan Union is a high-Tg (glass transition temperature) and high thermal reliability laminate designed to meet rigorous performance requirements. It is accompanied by TU-768P, a matching prepreg for enhanced functionality. These laminates and prepregs are constructed using high-quality woven E-glass coated with an epoxy resin system, offering UV-block characteristics and compatibility with automated optical inspection (AOI) processes. The TU-768 series is well-suited for applications that demand resilience against thermal cycles and extensive assembly work. Notably, TU-768 laminates exhibit exceptional CTE (coefficient of thermal expansion), superior chemical resistance, thermal stability, and CAF (conductive anodic filament) resistance properties.
Key Features:
- Dk (dielectric constant) of 4.3 at 10GHz
- Dissipation factor of .0023 at 10GHz
- CTE x-axis of 11-15 ppm/°C, CTE y-axis of 11-15 ppm/°C
- Coefficient of thermal expansion matched to copper
- Decomposition Temperature (Td) of 350 °C TGA
- Tg (glass transition temperature) of 180°C
- High thermal reliability with T260 >60 min, T288>15 min,
T300 >2 min
Benefits:
- Compatible with lead-free processes
- Excellent coefficient of thermal expansion for stability
- Anti-CAF (conductive anodic filament) property for improved
reliability
- Superior chemical and thermal resistance
- Fluorescent properties enable AOI (automated optical inspection)
- Resistant to moisture-related issues
| Typical Values | Conditioning | IPC-4101 /126 | |
| Thermal | |||
| Tg (DMA) | 190°C | ||
| Tg (DSC) | 180°C | > 170°C | |
| Tg (TMA) | 170°C | E-2/105 | |
| Td (TGA) | 350°C | > 340°C | |
| CTE x-axis | 11~15 ppm/°C | N/A | |
| CTE y-axis | 11~15 ppm/°C | E-2/105 | N/A |
| CTE z-axis | 2.70% | < 3.0% | |
| Thermal Stress,Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T260 | > 60 min | > 30 min | |
| T288 | > 20 min | E-2/105 | > 15 min |
| T300 | > 2 min | > 2 min | |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| DK & DF | |||
| Permittivity (RC 50%) @10GHz | 4.3 | ||
| Loss Tangent (RC 50%) @10GHz | 0.018 | ||
| Electrical | |||
| Permittivity (RC50%) | |||
| 1GHz (SPC method/4291B) | 4.4 / 4.3 | < 5.2 | |
| 5GHz (SPC method) | 4.3 | E-2/105 | N/A |
| 10GHz (SPC method) | 4.3 | N/A | |
| Loss Tangent (RC50%) | |||
| 1GHz (SPC method/4291B) | 0.019 /0.018 | < 0.035 | |
| 5GHz (SPC method) | 0.021 | E-2/105 | N/A |
| 10GHz (SPC method) | 0.023 | N/A | |
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | A | > 30 KV/mm |
| Dielectric Breakdown | > 50 kV | A | > 40 KV |
| Mechanical | |||
| Young’s Modulus | |||
| Warp Direction | 25 GPa | A | N/A |
| Fill Direction | 22 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz RTF Cu foil | 7~9 lb/in | A | > 4 lb/in |
| Water Absorption | 0.18% | E-1/105+D-24/23 | < 0.8 % |
PCB Stackup:
This PCB is a 2-layer rigid PCB design with the following
specifications:
- Copper_layer_1: 35 μm
- TU-768 Core: 0.76 mm
- Copper_layer_2: 35 μm
PCB Construction Details:
- Board dimensions: 47.8mm x 47.8mm (1PCS), with a tolerance of +/-
0.15mm
- Minimum Trace/Space: 4/4 mils, allowing for precise circuitry
- Minimum Hole Size: 0.2mm, providing flexibility for component
placement
- No blind vias, simplifying the manufacturing process
- Finished board thickness: 0.8mm, balancing durability and
compactness
- Finished Cu weight: 1oz (1.4 mils) outer layers, ensuring
efficient conduction
- Via plating thickness: 20 μm, enabling reliable interconnectivity
- Surface finish: Immersion Gold, for protection and improved
conductivity
- Top Silkscreen: White, facilitating component identification
- Bottom Silkscreen: None, for a clean and minimalistic appearance
- Top Solder Mask: Black, enhancing soldering and protection
- Bottom Solder Mask: None, for a simplified PCB design
- Each PCB undergoes a 100% electrical test prior to shipment,
ensuring quality and functionality
PCB Statistics:
- Components: 11, providing versatility for various applications
- Total Pads: 24, facilitating component connectivity
- Thru Hole Pads: 15, enabling secure connections
- Top SMT Pads: 9, supporting surface mount technology (SMT)
components
- Bottom SMT Pads: 0, indicating single-sided SMT assembly
- Vias: 7, allowing for efficient signal routing
- Nets: 2, ensuring proper connectivity
| PCB Material: | High-Tg and High Thermal Reliability Epoxy Resin |
| Designation: | TU-768 |
| Dielectric constant: | 4.3 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
| PCB thickness: | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 62mil(1.575mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Artwork Supplied:
This PCB artwork is provided in Gerber RS-274-X format, a widely
used industry standard for PCB manufacturing. This format ensures
compatibility and accuracy during the fabrication process.
Quality Standard and Availability:
The PCB adheres to the IPC-Class-2 quality standard, guaranteeing
high-quality manufacturing and reliability. It is available for
purchase worldwide, making it accessible to customers globally.
Typical Applications:
The TU-768 PCB is widely applicable in various fields, including:
- Consumer Electronics
- Servers and workstations
- Automotive industry
With its high-Tg and thermal reliability features, the TU-768 PCB is an excellent choice for demanding electronic applications that require exceptional performance and durability.
