Active Member
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[China]
Address: Room 1520, Block 11, International E-Commerce Logistics Center, PingAn Road, PingHu Street, LongGang District, ShenZhen City, China 518111
Contact name:Steven YU
Witgain Technology Limited |
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Multilayer Circuit Board 20 Layer PCB FR4 Material 2.5/2.5Mil Lind Space&Width
PCB Specifications:
1 Part NO: Multi-Layer PCB0024
2 Layer Count: 20 Layer PCB
3 Finished Board Thickness: 2.4MM
4 Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H1
5 Min Lind Space&Width: 2.5/2.5mil
6 Application Area: Consumer Porducts
| IR No : QCR Reference : Date: | ||||||
| PCB DESCRIPTION | ||||||
| C-dot Part Number of PCB | ||||||
| Name of the PCB | ||||||
| No of Layers : | 20 | Density Classification : E | ||||
| PCB Size: | Length | Breadth | Unit | Thickness | ||
| 280 | X | 322.25 | mm | 2.4 mm | ||
| Panel Size: | 290 X 322.25 mm 2.4 mm | |||||
| Number of PCBs per Panel : | 1 | |||||
| DESIGN & DRILL DATA | ||||||
| Input type : | Gerber Files | Qty 27 | ||||
| Input Code : | ASCII | |||||
| Number Format : | 2.4 | |||||
| Units : | Inches | |||||
| Zero Omit : | Trailing | |||||
| Coordinates: | Absolute | |||||
| Scale : | 1:1 | |||||
| DRC CHECKS FOR SIGNAL LAYERS | ||||||
| Minimum Track width : | Inner Layer 3.75 mils | Outer Layer 5 mils | ||||
| Minimum Spacing between Tracks : | Inner Layer 5 mils | Outer Layer 5 mils | ||||
| Minimum Spacing between Pad & Track: | Inner Layer 4 mils | Outer Layer 5 mils | ||||
| Minimum PTH Size: | 10 mils | |||||
| Minimum Annular Ring: | 4 mils | |||||
| Minimum SMD Pitch: | 19.685 mils | |||||
| FILM & GERBER DETAILS | ||||||
| Description | Films | File Name | Description | Films | File Name | |
| Drill | DRL | ABC00DRL.GBX | Etch Layer 17 | L17 | ABC00L17.GBX | |
| Solder Paste Top | SPT | ABC00SPT.GBX | Etch Layer 18 | L18 | ABC00L18.GBX | |
| Legend Top | LGT | ABC00LGT.GBX | Etch Layer 19 | L19 | ABC00L19.GBX | |
| Solder Mask Top | SMT | ABC00SMT.GBX | Etch Layer 20 | L20 | ABC00L20.GBX | |
| Etch Layer 1 | L01 | ABC00L01.GBX | Etch Layer 21 | L21.GBX | ||
| Etch Layer 2 | L02 | ABC00L02.GBX | Etch Layer 22 | L22.GBX | ||
| Etch Layer 3 | L03 | ABC00L03.GBX | Etch Layer 23 | L23.GBX | ||
| Etch Layer 4 | L04 | ABC00L04.GBX | Etch Layer 24 | L24.GBX | ||
| Etch Layer 5 | L05 | ABC00L05.GBX | Etch Layer 25 | L25.GBX | ||
| Etch Layer 6 | L06 | ABC00L06.GBX | Etch Layer 26 | L26.GBX | ||
| Etch Layer 7 | L07 | ABC00L07.GBX | Etch Layer 27 | L27.GBX | ||
| Etch Layer 8 | L08 | ABC00L08.GBX | Etch Layer 28 | L28.GBX | ||
| Etch Layer 9 | L09 | ABC00L09.GBX | Etch Layer 29 | L29.GBX | ||
| Etch Layer 10 | L10 | ABC00L10.GBX | Etch Layer 30 | L30.GBX | ||
| Etch Layer 11 | L11 | ABC00L11.GBX | Solder Mask Bottom | SMB | ABC00SMB.GBX | |
| Etch Layer 12 | L12 | ABC00L12.GBX | Legend Bottom | LGB | ABC00LGB.GBX | |
| Etch Layer 13 | L13 | ABC00L13.GBX | Solder Paste Bottom | SPB | ABC00SPB.GBX | |
| Etch Layer 14 | L14 | ABC00L14.GBX | NC Drill | NCD | ABC00_NCD.TAP | |
| Etch Layer 15 | L15 | ABC00L15.GBX | NC Drill Tool Set | NCT | ABC00NCT.TXT | |
| Etch Layer 16 | L16 | ABC00L16.GBX | Decode List | DCL.TXT | ||
| MANUFACTURING DETAILS | |
| Solder Mask Type : | Photo Imageable |
| Minimum Solder Mask Clearance : | 2.5 mils |
| Legend On (Side) : | Both |
| Design Technology | Mixed |
| Special Requirements : | |
Controlled Impedance : Yes Back dril from Bottom : 7 Layers / Files Back drill pin count : 156 pins | |
| BGA Used | |
| Base Material | FR408HR |
| If base material is other than FR4 please provide complete details of the material: | |
| Surface Finish | Electroless gold over nickel (ENIG) |
| Gold Plating required for Edge fingers No of Edge Fingers/Total Area (Specify , if the option is 'yes') | No |
| Nos/ Sq Inches | |
| Automatic Copper Balancing Allowed | Yes |
| Tear Drop | Triangular to be added by the fabricator |
| Constructional Details Drawing No | Layer stackup |
| MISCELLANEOUS DETAILS | |
The PCB 1. Has vias on pads filled with epoxy and plated with planner.2. Has back-drill vias filled with epoxy 3. Has ENIG surface finish. 4. Five Back drill NCD files attached 5. Depanalizing pcb by slot cut. Back drill layers: 1.Bottom to Layer19, 2.Bottom to Layer17, 3.Bottom to Layer15, 4.Bottom to Layer10, 5.Bottom to Layer08, 6.Bottom to Layer06, 7.Bottom to Layer04. | |
| APPROVALS | |
| Designer Name | Approved by |
Layer Stackup:
| Layer No. | Layer Type | Di-electric (Prepreg/ Core) | Di-electric constant | Processed Thickness (mil) | Target Impedance - Single Ended (+/- 10%) | Trace Width (Single ended) (mil) | Target Impedance – differential (+/- 10%) | Trace Width/ separation (differential pair) (mil) |
| MASK | 4.0 | 2.0 | ||||||
| 1 | TOP | Copper Foil 12 microns
| 1.772 | 50 ohm 55 ohm | 7 6 | 100ohm 95ohm 90ohm | 5-8-5 5-6.5-5 5-5.5-5 | |
| PrepreG | 3.23 | 2.101 | ||||||
| PrepreG | 3.23 | 2.101 | ||||||
| 2 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 3 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 4 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 5 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 6 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 7 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 8 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 9 | POWER | Copper | 2.638 | |||||
| PrepreG | 3.23 | 0.788 | ||||||
| PrepreG | 3.23 | 0.788 | ||||||
| 10 | GND | Copper | 2.638 | |||||
| core | 3.37 | 3.9 | ||||||
| 11 | POWER | Copper | 2.638 | |||||
| PrepreG | 3.23 | 0.788 | ||||||
| PrepreG | 3.23 | 0.788 | ||||||
| 12 | POWER | Copper | 2.638 | |||||
| core | 3.37 | 3.9 | ||||||
| 13 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 14 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| CORE | 3.37 | 3.9 | ||||||
| 15 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 16 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| CORE | 3.37 | 3.9 | ||||||
| 17 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 18 | SIGNAL | Copper | 0.689 | 50 ohm 55 ohm | 4 3.75 | 100ohm 95ohm 90ohm | 4-7-4 4-6-4 4-4.5-4 | |
| CORE | 3.37 | 3.9 | ||||||
| 19 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 2.101 | ||||||
| PrepreG | 3.23 | 2.101 | ||||||
| 20 | SOLDER | Copper Foil 12 microns
| 1.772 | 50 ohm 55 ohm | 7 6 | 100ohm 95ohm 90ohm | 5-8-5 5-6.5-5 5-5.5-5 | |
| MASK | 2.0 |
