High TG Hybrid Multilayer PCB Circuit Board 12 Layer FR4 Material Immserion Gold

Multilayer Circuit Board 12 Layer PCB FR4 Material Hight TG Immserion Gold

Main Features:

Part NO: Multi-Layer PCB0001

Layer Count: 12 Layer HDI PCB

Finished Board Thickness: 1.6MM

Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H1

Min Lind Space&Width: 3/3mil

Application Area: Consumer Porducts

Outline Size: 230MM*95MM/1PCS

Outline tolerance: +/-0.13mm

Copper wall thickness for plated through holes: 25um

Packing Specifications:

1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.

PCB report have to include the following information:

1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage;

2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin;

3 Other: date code, quantity etc.